Installation manual

Publication 1394-IN002B-EN-P — February 2004
Installing Your 1394 SERCOS Interface System 1-11
Bonding Multiple Subpanels
Bonding multiple subpanels creates a common low impedance exit
path for the high frequency energy inside the cabinet. Subpanels that
are not bonded together may not share a common low impedance
path. This difference in impedance may affect networks and other
devices that span multiple panels.
Figure 1.6
Bonding Multiple Subpanels
R
ecommen
d
e
d
:
Bond the top and bottom of each subpanel to the cabinet
using 25.4 mm (1.0 in.) by 6.35 mm (0.25 in.) wire braid
Bonded cabinet
ground bus to
subpanel
Scrape the paint around each fastener to
maximize metal to-metal-contact.