User's Manual

Page 26 of 36
May 16, 2019
Data Sheet and User Manual
AES-MS-MT3620-M-G Module
Data Sheet and User Manual
Soldering and Cleaning Recommendations
Optimum Soldering Reflow Profile
Figure 8 – Recommended Soldering Profile for Lead-Free Solder
 Solder joint quality between the AES-MS-MT3620 Azure Sphere Module’s surface mount pads and
their bonding with the host board should meet the appropriate IPC Specification.
(See IPC-A-610-D Acceptability of Electronic Assemblies, section 8.2.1 “Bottom Only Terminations”)
 It is recommended that only a single reflow soldering process be permitted for the host board
 Any attempts at reworking the module will invalidate warrantee coverage and regulatory certifications
Cleaning
 Cleaning of the populated module is not recommended!
 Residuals under the module cannot be easily removed by any cleaning process
(Water / Solvents / Ultrasonic)