User's Manual

Page 31 of 36
May 16, 2019
Data Sheet and User Manual
AES-MS-MT3620-M-G Module
Data Sheet and User Manual
OEM Instructions
This module is certified for installation into OEM end-products under the following conditions:
1) The intended use of this AES-MS-MT3620-M-G module is for indoor locations. If the end product
using this module is able to operate in the band 5150-5250 MHz within Canada, it is only allowed to
be used indoors (to reduce potential harmful interference to co-channel mobile satellite systems)
The label of the end product in this case must include the text “For indoor use only”
2) It’s intended use is as a Wi-Fi client only (not a Wi-Fi access point or used in point-to-point mode)
3) The AES-MS-MT3620-M-G module is for (OEM) installation only.
The requirement for software security of UNII devices, is fully met by Microsoft Azure Sphere's advanced
security. Software updates require certificate-based authentication using hardware-based root of trust.
The device is set to “AllComplete” to permanently disable any access to any RF-related software changes.
https://docs.microsoft.com/en-us/azure-sphere/hardware/factory-floor-tasks#set-the-device-manufacturing-
state-to-manufacturing-complete
Shipping, Handling and Storage
Shipping
Bulk orders of Avnet AES-MS-MT3620 Azure Sphere Modules are delivered in reels of 600.
(See detail under the section on Tape & Reel Packaging)
Handling
AES-MS-MT3620 Azure Sphere Modules contain sensitive electronic circuitry that require proper ESD
protection when handling. Failure to follow these ESD procedures may result in permanent damage to the
module.
The module should not be subjected to excessive mechanical shock.
Moisture Sensitivity (MSL)
Modules that have been exposed to moisture and environmental conditions exceeding the prescribed
packaging and storage conditions detailed in J-STD-020 (eg. not continuously in a sealed bag with a
desiccant pack) MUST be baked before mounting! (Failure to meet the packaging and storage conditions
described, will result in irreparable damage to modules during solder reflow soldering).
For devices that are packaged in a Moisture Barrier Bag with a desiccant pack and HIC (Humidity Indicator
Card), the HIC card should be referenced and J-STD-033 consulted to determine if baking is required prior
to reflow soldering.
In cases where baking is required, refer to J-STD-033 for details of the bake procedure.
“Broken reel” module quantities (under 600 units) typically require baking before reflow soldering