Specifications

4.Inspection Standard
4.1 Major Defect
4.1.1
All
functional
defects
1) No display
2) Display abnormally
3) Missing verticalhorizontal segment
4) Short circuit
5) Back-light no lighting, flickering and abnormal lighting.
4.1.2 Missing
Missing component
4.1.3
Outline
dimension
Overall outline dimension beyond the drawing is not allowed.
Major
4.2 Cosmetic Defect
4.2.1 Module Cosmetic Criteria
No. Item Judgement Criterion Partition
1 Difference in Spec. None allowed Major
2 Pattern peeling No substrate pattern peeling and floating Major
3 Soldering defects No soldering missing
No soldering bridge
No cold soldering
Major
Major
Minor
4 Resist flaw on Printed
Circuit Boards
visible copper foil (∅0.5mm or more) on substrate pattern
Minor
5 Accretion of metallic
Foreign matter
No accretion of metallic foreign matters (Not exceed ∅0.2mm)
Minor
Minor
6 Stain No stain to spoil cosmetic badly Minor
7 Plate discoloring No plate fading, rusting and discoloring Minor
8 Solder amount
1. Lead parts
a. Soldering side of PCB
Solder to form a ‘Filet’
all around the lead.
Solder should not hide the
lead form perfectly. (too much)
b. Components side
( In case of ‘Through Hole PCB’ )
Solder to reach the Components side of PCB.
Minor
2. Flat packages Either ‘Toe’ (A) or ‘Seal’ (B) of
the lead to be covered by ‘Filet’.
Lead form to be assume over
solder.
Minor
3. Chips
(3/2) H ≥ h ≥ (1/2) H
Minor
Item
No
Items to be
inspected
Inspection Standard
Classification of
defects
H
h
A
B
P.12
MULTI-INNO TECHNOLOGY CO.,LTD.
MODULE NO.: MI12864J-G-1
Ver 1.0