Specifications

9 Solder ball/Solder
splash
a. The spacing between solder ball and
the conductor or solder pad h ≥0.13mm.
The diameter of solder ball d
≤0.15mm.
b. The quantity of solder balls or solder
Splashes isn’t beyond 5 in 600 mm
2
.
c. Solder balls/Solder splashes do not violate minimum electrical
clearance.
d. Solder balls/Solder splashes must be entrapped/encapsulated
Or attached to the metal surface .
NOTE: Entrapped/encapsulated/attached is intended to mean
that normal service environment of the product will not cause
a solder ball to become dislodged.
Minor
Minor
Major
Minor
4.2.2Cosmetic Criteria (Non-Operating)
No. Defect Judgment Criterion Partition
1 Spots In accordance with Screen Cosmetic Criteria (Operating) No.1. Minor
2 Lines In accordance with Screen Cosmetic Criteria (Operating) No.2. Minor
3 Bubbles in polarizer
Size : d mm Acceptable Qty in active area
d
≤ 0.3
Disregard
0.3 < d ≤ 1.0
3
1.0 < d ≤ 1.5
1
1.5 < d
0
Minor
4 Scratch In accordance with spots and lines operating cosmetic criteria. When the
light reflects on the panel surface, the scratches are not to be remarkable.
Minor
5 Allowable density Above defects should be separated more than 30mm each other. Minor
6 Coloration Not to be noticeable coloration in the viewing area of the LCD panels.
Back-lit type should be judged with back-lit on state only.
Minor
7 Contamination
Not to be noticeable.
Minor
h
d
h
P.13
MULTI-INNO TECHNOLOGY CO.,LTD.
MODULE NO.: MI12864J-G-1
Ver 1.0