Data Sheet

ManualsBrandsAzureWave Technologies ManualsElectronicsIEEE 802.11 1X1 a/b/g/n Wireless LAN + Bluetooth 5.1 Combo 12 x 12 LGA Module

Table Of Contents

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10.

Stamp Module stencil and Pad opening Suggestion

 Stencil thickness：0.10~0.12mm

 Function Pad opening size suggestion: Max. 1:1

PS: This opening suggestion just for customer reference, please discuss with AzureWave’s Engineer before

you start SMT.

 Solder Printer Opening and Customer PCB Footprint suggestion.

 Example:

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