User`s manual

Notes for handling CPU modules
MELSEC System Q, Hardware 4 – 21
4.3 Notes for handling
Precautions
Do not drop the module case or subject it to heavy impact since it is made of resin. Do not remove
the printed-circuit board of each module from its case.
When drilling screw holes or wiring, cutting chips or wire chips should not enter ventilation slits.
NOTE Fixing the module with a screw
The modules of MELSEC System Q can be secured with an additional screw (M3×12) to the
base unit. Under normal conditions this screw is not needed. But it is recommended to use the
screw, if large vibration is expected.
Tighten the module fixing screws within the specified tightening torque range of 36 to 48 Ncm.
E
CAUTION:
● Do not open the case of a module. Do not modify a module. This may cause fire,
injuries or malfunction.
● Use the product in the environment within the general specifications described in
the Hardware Manual of MELSEC System Q. Never use the product in areas with
dust, oily smoke, conductive dusts, corrosive or flammable gas, vibrations or
impacts, or expose it to high temperature, condensation, or wind and rain.
● Cut off all phases of the power source externally before starting the installation or
wiring work. Not doing so may cause failure or malfunction of the module.
● Do not drop or apply shock to the battery to be installed in the module. Doing so
may damage the battery, causing the battery fluid to leak inside the battery. If the
battery is dropped or any shock is applied to it, dispose of it without using.
● After the first use of the product, do not mount or remove the module to or from
the base unit, and the terminal block to or from the module more than 50 times (IEC
61131-2 compliant) respectively. Exceeding this limit may cause malfunction.
● Before handling modules, touch a grounded metal object to discharge the static
electricity from the human body.