Datasheet

TEST ITEMS AND RESULTS
etoN snoitidnoC tseT metI tseT
Number of
Damaged
Resistance to Soldering
Heat (Reflow Soldering)
JEITA ED-4701
300-301
Tald=260±５℃ ４ｓｅｃ
（Ｌｅａｄｆｒｅｅ Ｓｏｌｄｅｒ）
2 times 0/50
Solderability
(Reflow Soldering)
JEITA ED-4701
300-303
Tald=21５±５℃ ３ｓｅｃ
（Ｌｅａｄ Ｓｏｌｄｅｒ）
1 time over
95%
0/50
Thermal Shock
MIL-STD 202-107D
MIL-STD 705-1051
MIL=STD 808-1011
0℃ － １００℃
１５ｓｅｃ．１５ｓｅｃ
20cycles 0/50
Temperature Cycle
JEITA ED-4701
100-105
-40℃ － ２５℃ － １００℃ － ２５℃
３０ｍｉｎ． ５ｍｉｎ． ３０ｍｉｎ． ５ｍｉｎ
100 cycles 0/50
Moisture Resistance Cyclic
JEITA ED-4701
200-203
25℃ － ６５℃－ －１０℃
９０％ＲＨ ２４ｈｒｓ／１ｃｙｃｌｅ
10 cycles 0/50
Temperature Humidity
Storage
MIL-STD202-103B
JIS-C-7021 B-11
Ta=60℃ ＲＨ＝９０％
1000hrs 0/50
Low Temperature Storage JIS-C-7021 B-12 Ta=-40℃ 05/0 srh0001
Steady State Operating Life
of High Humidity Heat
MIL-STD202-103B
JIS-C-7021 B-11
85℃，ＲＨ＝８５％，Ｉｆ＝２０ｍＡ 500hrs 0/50
JUDGMENT CRITERIA OF FAILURE FOR THE RELIABILITY
Measuring items Symbol Measuring conditions Judgement criteria for failure
Forward voltage
VF(V)
2.1*U revO Am02=FI
Reverse current
IR(uA)
2*U revO V5=RV
Luminous intensity
IV(mcd)
5.0*S woleB Am02=FI
Note: 1.U means the upper limit of specified characteristics. S means initial value.
2.Measurment shall be taken between 2 hours and after the test pieces have been returned to
normal ambient conditions after completion of each test.
RELIABILITY