Datasheet

Application(Soldering)
Manual soldering (We do not recommend this method strongly.)
Soldering tin material: tin 6/4 alloy or contained Ag.
To prevent cracking, please bake before manual soldering.
keep the temperature on the edge of iron at 300 ℃ Max.(25W)and apply for 3
seconds.If the temperature become higher,apply in a shorter time (1sec)
In manual soldering, take care not to damage the package especially terminal or resin.
(Do not give stress to the product when soldering.)
Do not use again it you remove the soldered product.
It is recommended using an iron with a temperature control.
Reflow Soldering
Recommend tin glue specifications:
Melting temperature:150-26０℃
Contains:Sn 96.5% , Ag 3.0% ,Gu0.5 % JIS Z 3282TEST
Never take next process until the component is cooled down to room temperature after
reflow.
The recommended reflow soldering profile (measuring on the surface of the LED resin) is
following:
Cleaning
The conditions of cleaning after soldering:
An alcohol-based solvent such as lsopropyl Alcohol(IPA) is recommended.
Temperature Time:<50℃*30sec,or <30℃*3min
Ultra sonic cleaning:<15W/bath; Bath volume:1liter max.
Curing:100 max,<3min
Cautions of Pick and Place
It should be avoided to load stress on the resin during high temperature.
Avoid rubbing or scraping the resin by any object.
Electric-static may cause damage to the comp
onent. Please confirm that the equipment is
grounding well. Using an ionzer fan is recommended.
Cautions of Design and Applications
It should be done to connect with a current-limiting serial resistor.Avoid to drive reverse
voltage over the specifications on LEDwhen ON/OFF.
Any application should refer to the specifications of absolute maximum ratings.
The dimensions of the recommended soldering pattern may mot meet every user. Please
confirm and study first before designing the soldering patterm in order to obtain the best
performance of soldering.
Do not contact with any component on the assembly board.
Lead-free Temperature Profile
OVER 2 M I N
150∼C
4
∼C/SEC M AX.
4
∼C/SEC M A X.
4 SEC M AX.
260∼C M AX.
TEMPERATURE