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BDE-BLEM301

Bluetooth 5.1 LE Module

Datasheet

info@bdecomm.com

BDE Technology Inc.

1 / 24

General Description

BDE-BLEM301 is a highly integrated Bluetooth 5.1 Low Energy Module based on

Dialog ultra-low power DA14531 SoC.

It comprises a Cortex® M0+ MCU, on board Flash memory, Bluetooth 5.1 Low Energy

radio, a high efficiency PCB antenna, BT 5.1 stack, profiles and applications in a single

module. The module can be used with or without an external MCU. It also offers

flexible hardware interfaces for sensor applications. It enables ultra-low power connectivity and data

transfer for the applications that are sensitive to power consumption, size and cost.

Key Features

 Bluetooth

 Compatible with Bluetooth v5.1, ETSI

EN 300 328 and EN 300 440 Class 2

(Europe), FCC CFR47 Part 15 (US)

 Supports up to 3 BLE connections

 Processing and memories

 16 MHz 32-bit Arm® Cortex® M0+ with

SWD interface

 128 Kbytes internal FLASH

 48 Kbytes RAM

 144 Kbytes ROM

 32 Kbytes OTP

 Current Consumption

 2 mA RX at VBAT=3V

 4 mA TX at VBAT=3V and 0 dBm

 1.8 uA at sleep with all RAM retained

 Radio

 Programmable RF transmit power from

-19 to +2.2 dBm

 -93 dBm receiver sensitivity

 Interfaces

 Quadrature decoder with 3 channels

 4 channel 11-bit ENOB ADC

 2 general purpose timers with PWM

capabilities

 Built in temperature sensor

 9 GPIOs

 SPI

 2 x UART, 1wire UART support

 I2C

 Power Management

 Operating range (1.8V - 3.3V)

 Inrush current control

 Other

 Real Time Clock

 Packaging

 12.5 mm x 14.5 mm x 2.1 mm package

 Module Software Development Kit

 Configurable DSPS

 Codeless v2.0

 SDK6 support

 Module Software Tools

 Flash/OTP programmer

 SUOTA support

 Battery Life Estimation

 Data Rate Monitoring

 Real-Time Power Profiling

 Production Line Testing

 Standards Conformance

 BQB

 ETSI EN 300 328 and EN 300 440 Class

2 (Europe)

 FCC CFR47 Part 15 (US)

 Compatible with DA14531MOD

Applications

 Beacons

 Remote Controls

 Proximity tags

 Low Power Sensors

 Commissioning/Provisioning

 Toys

 Serial port transmission

 Smart home

 Smart meters

 Smart medical devices

Summary of content (24 pages)

PAGE 1
BDE-BLEM301 Datasheet Bluetooth 5.1 LE Module General Description BDE-BLEM301 is a highly integrated Bluetooth 5.1 Low Energy Module based on Dialog ultra-low power DA14531 SoC. It comprises a Cortex® M0+ MCU, on board Flash memory, Bluetooth 5.1 Low Energy radio, a high efficiency PCB antenna, BT 5.1 stack, profiles and applications in a single module. The module can be used with or without an external MCU. It also offers flexible hardware interfaces for sensor applications.
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BDE-BLEM301 Datasheet Bluetooth 5.1 LE Module Contents General Description .................................................................................................................................. 1 Key Features .............................................................................................................................................. 1 Applications....................................................................................................................................
PAGE 3
BDE-BLEM301 Datasheet Bluetooth 5.1 LE Module 1. References [1] DA14531, Datasheet, Revision 3.0, Dialog Semiconductor. [2] DA14531 TINYTM Module, Datasheet, Revision 1.0, Dialog Semiconductor. [2] DA14585/DA14531 SW Platform Reference Manual (https://www.dialogsemiconductor.com/products/connectivity/bluetooth-low-energy/products/da14531) BDE Technology Inc. 3 / 24 info@bdecomm.
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BDE-BLEM301 Datasheet Bluetooth 5.1 LE Module 2. Block Diagram BLEM301 module is based on the Dialog Semiconductor DA14531 SoC configured in buck mode. With an integrated 128Kbytes flash, 32MHz XTAL and a on board PCB antenna, it allows faster time to market at reduced development cost.
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BDE-BLEM301 Datasheet Bluetooth 5.1 LE Module 3. Pinout Figure 2: Pinout Diagram Top View Note that, J1 has no internal connection and for this reason presents a difference pad shape. It was used ONLY for providing RF signal for certification purposes.
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BDE-BLEM301 Datasheet Bluetooth 5.1 LE Module Pin # Pin Name Type Reset State DIO (Type A) I-PD DIO (Type B) I-PD P0_10 J9 SWDIO J10 J11 J12 P0_2 SWCLK GND P0_0 GND DIO (Type B) Note 2 I-PD RST J13 P0_7 DIO (Type A) I-PD J14 P0_5 DIO (Type B) I-PD J15 P0_9 DIO (Type A) I-PD J16 P0_8 DIO (Type A) I-PD Description INPUT/OUTPUT with selectable pull up/down resistors. Pull-down enabled during and after reset. General purpose I/O port bit or alternate function nodes.
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BDE-BLEM301 Datasheet Bluetooth 5.1 LE Module 4. Characteristics All MIN/MAX specification limits are guaranteed by design, production testing and/or statistical characterization. Typical values are based on characterization results at default measurement conditions and are informative only. Default measurement conditions (unless otherwise specified): VBAT= 3.0 V, TA = 25 ℃. All radio measurements are performed with standard RF measurement equipment. 4.1.
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BDE-BLEM301 Datasheet Bluetooth 5.1 LE Module Parameter IBAT_BLE_CONN_30ms IBAT_FLASH IBAT_HIBERN IBAT_IDLE IBAT_SLP_20KB IBAT_SLP_48KB IBAT_RF_RX IBAT_RF_TX_0dBm IBAT_RF_TX_+3dBm IBAT_RF_TX_-3dBm Description Average battery supply current with system in a connection state with 30ms connection interval and extended sleep with all RAM retained. TX output power at 2dBm. FLASH is off. Battery supply current with CPU fetching code from serial FLASH. RF is off.
PAGE 9
BDE-BLEM301 Datasheet Bluetooth 5.
PAGE 10
BDE-BLEM301 Datasheet Bluetooth 5.1 LE Module Table 9: Radio 1Mbps - AC Characteristics Parameter Description PSENS_EPKT Sensitivity level BDE Technology Inc. Conditions Extended packet size (255 octets) 10 / 24 Min Typ -91 Max Unit dBm info@bdecomm.
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BDE-BLEM301 Datasheet Bluetooth 5.1 LE Module 5. Mechanical Specifications 5.1. Dimensions The module dimensions are presented in the following figure: Figure 3: Mechanical Drawing BDE Technology Inc. 11 / 24 info@bdecomm.
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BDE-BLEM301 Datasheet Bluetooth 5.1 LE Module 5.2. PCB Footprint The footprint for the PCB is presented in the following figure: Figure 4: Module Footprint Top View 5.3. Marking Figure 5: Indicative Module Shield Marking BDE Technology Inc. 12 / 24 info@bdecomm.
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BDE-BLEM301 Datasheet Bluetooth 5.1 LE Module 6. Packaging Information 6.1. Tape & Reel Tape & Reel or Tray, 1K MPQ. 6.2. Labeling Figure 6: Reel Label 7. Application Information A typical reference diagram of BDE-BLEM301 is presented in the following figure: Figure 7: Reference Diagram BDE Technology Inc. 13 / 24 info@bdecomm.
PAGE 14
BDE-BLEM301 Datasheet Bluetooth 5.1 LE Module There are some special considerations regarding using this module, namely: • RST signal is shared with the MOSI input of the NOR flash. For this reason, RST must not be driven to GND. When internal Flash is in use, reset functionality is not available. • The SPI Bus of DA14531 is used for the communication of the BLE SoC with the NOR Flash at boot time. Three of the four signals are not driven to external module pins.
PAGE 15
BDE-BLEM301 Datasheet Bluetooth 5.1 LE Module degradation depends on the host system characteristics. Following table summarizes antenna efficiency for different placements on a host PCB as indicated in Figure 9. Table 10: Antenna gain and efficiency vs module positions Frequency 2400 MHz 2410 MHz 2420 MHz 2430 MHz 2440 MHz 2450 MHz 2460 MHz 2470 MHz 2480 MHz 2490 MHz 2500 MHz Position #1 Gain (dBi) Efficiency 2.68 51.02% 2.67 51.60% 2.73 51.24% 2.90 51.52% 3.15 54.14% 3.26 56.49% 3.20 57.63% 3.15 56.
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BDE-BLEM301 Datasheet Bluetooth 5.1 LE Module Figure 10: Antenna Performance Proximity with Copper (Left), Laminate (Middle) and Laminate Under Antenna (Right) The actual module evaluation board layout that has been used to conduct all measurements is presented in the following figure: Figure 11: Module Evaluation Board Dimension BDE Technology Inc. 16 / 24 info@bdecomm.
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BDE-BLEM301 Datasheet Bluetooth 5.1 LE Module 8.2. Antenna Graphs Antenna VSWR measurements for the three mounting positions are described in the following figures: Figure 12: VSWR Mounted in the Upper Left Corner (Position #1) of Evaluation Board BDE Technology Inc. 17 / 24 info@bdecomm.
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BDE-BLEM301 Datasheet Bluetooth 5.1 LE Module Figure 13: VSWR with Module Mounted in Center (Position #2) of the Evaluation Board BDE Technology Inc. 18 / 24 info@bdecomm.
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BDE-BLEM301 Datasheet Bluetooth 5.1 LE Module Figure 14: VSWR with Module Mounted in Center (Position #2) of the Evaluation Board BDE Technology Inc. 19 / 24 info@bdecomm.
PAGE 20
BDE-BLEM301 Datasheet Bluetooth 5.1 LE Module 8.3. Radiation Pattern The module is tested with the placement to the left corner of the host PCB, and the orientation is as below picture. The antenna radiation pattern measurements are carried out in an anechoic chamber. Radiation patterns are presented for three measurement planes: XY, XZ and YZ planes. Figure 15: The Orientation of the DUT Figure 16: XZ Plane (Phi = 0°) BDE Technology Inc. 20 / 24 info@bdecomm.
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BDE-BLEM301 Datasheet Bluetooth 5.1 LE Module Figure 17: YZ Plane (Phi = 90°) Figure 18: XY Plane (Theta = 90°) BDE Technology Inc. 21 / 24 info@bdecomm.
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BDE-BLEM301 Datasheet Bluetooth 5.1 LE Module 9. Soldering Figure 19: Typical Reflow Profife 10. Ordering Information Table 11: Ordering Information Part Number BDE-BLEM301 Size (mm) 12.5 x 14.5 x 2.1 Shipping Form Tape & Reel MOQ 1000 11. Regulatory Information 11.1. Integration Instructions Integration instructions for host product manufacturers according to KDB 996369 D03 OEM Manual v01 2.2 List of applicable FCC rules FCC Part 15.247 2.
PAGE 23
BDE-BLEM301 Datasheet Bluetooth 5.1 LE Module minimum of 20cm separation between antenna and body. The host product manufacturer would provide the above information to end users in their end-product manuals. 2.7 Antennas PCB antenna: 2.9dBi, 2.402 GHz~2.480GHz 2.8 Label and compliance information The end product must carry a physical label or shall use e-labelling followed KDB784748D01 and KDB 784748 stating “Contains Transmitter Module FCC ID: 2ABRU-BLEM301”. 2.
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BDE-BLEM301 Datasheet Bluetooth 5.1 LE Module For 15 B (§15.107 and if applicable §15.107) compliance, the host manufacturer is required to show compliance with 15 while the module is installed and operating. Furthermore the module should be transmitting and the evaluation should confirm that the module's intentional emissions (15C) are compliant (fundamental / out-of-band). Finally the integrator has to apply the appropriate equipment authorization (e.g.