Data Sheet

Bluetooth 5.1 Dual Mode Module
Datasheet
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BDE Technology Inc.
BDE-BDM209A
2 / 17
Standby, and Scan Bluetooth Modes
 Shutdown and Sleep Modes to Minimize
Power Consumption
 MCU Ultra-low-power operating modes when
Bluetooth is Shutdown
 Active: 80 µA/MHz
 Low-frequency active: 83 µA at 128 kHz
 LPM3 (with RTC): 660 nA
 LPM3.5 (with RTC): 630 nA
 LPM4: 500 nA
 LPM4.5: 25 nA
 Operating characteristics
 Wide supply voltage range: 2.05V to 3.7V
 Temperature range: –40°C to 85°C
 Flexible clocking features
 Tunable internal DCO (up to 48 MHz)
 32.768-kHz low-frequency crystal
support (LFXT)
 High-frequency crystal support
(HFXT) up to 48 MHz
 Low-frequency internal reference
oscillator (REFO)
 Very low-power low-frequency
internal oscillator (VLO)
 Module oscillator (MODOSC)
 System oscillator (SYSOSC)
 Code security features
 JTAG and SWD lock
 IP protection (up to four secure flash
zones, each with configurable start
address and size)
 Enhanced system features
 Programmable supervision and
monitoring of supply voltage
 Multiple-class resets for better control of
application and debug
 RTC with calendar and alarm functions
 Timing and control
 Up to four 16-bit timers, each with up to
five capture, compare, PWM capability
 Two 32-bit timers, each with interrupt
generation capability
 Physical Interfaces:
 UART with automatic baud-rate
detection
 I2C (with multiple-slave addressing)
 SPI (up to 16 Mbps)
 Up to 17 GPIOs for users
 All GPIOs with capacitive-touch
capability
 Ultra-low-leakage I/Os (±20 nA
maximum)
 Up to 15 I/Os with interrupt and wake-up
capability
 Two I/Os with glitch filtering capability
 Fully Programmable Digital Pulse-Code
Modulation (PCM)–I2S Codec Interface
 Antenna: Multilayer Chip Antenna or U.FL
connector
 Encryption and data integrity accelerators
 128-, 192-, or 256-bit AES encryption and
decryption accelerator
 32-bit hardware CRC engine
 Bluetooth 4.2 Dual-mode stack
 dual-mode Bluetooth 4.2 certified and
royalty free
 Fully qualified Bluetooth stack (QDID
85355 and QDID 69886)
 Classic Bluetooth Profiles Available
 A2DP1.2, AVDTP1.2, AVRCP1.3, HSP1.2,
GAP, HID1.0, MAP1.0, PBAP1.0,
RFCOMM, SDP, SPP.
 Bluetooth low energy Profiles Available
 ANS1.0, BAS1.0, CSCS1.0, DIS1.0, FMP1.0,
GAPS1.0, GATT1.0, HTS1.0, HRS1.0,
HIDS1.0, IAS1.0, LLS1.0, PASS1.0, PXP1.0,
TPS1.0.
 MFi Support
 iAP Protocol (iAP 1/iAP 2) provided as an
add-on upon request
 Packaging
 12 mm x 22 mm x 2.1 mm package
 Large variety of Sample Applications
 Classic Bluetooth Sample Applications
include: A3DP Sink/Source, HFP, HID, HSP,
MAP, PBAP, SPP application demos.
 BLE Sample Applications include: ANP,
iBeacon, HRP, HTP, PASP, HOGP, PXP, FMP,
CSCP application demos.
 Classic Bluetooth + Bluetooth low energy
Sample Applications include: SPP+SPPLE,
SPP DMMulti application demos.
 Development Environment supports:
 CCS, Keil®, and IAR Embedded
Workbench® IDEs.
 Standards Conformance
 BQB
 ETSI EN 300 328 and EN 300 440 Class 2
(Europe)
 FCC CFR47 Part 15 (US)