Users Manual
Manuals
Brands
BDE Manuals
Electronics
Multi-Protocol Wireless Module with PA
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Table Of Contents
Fig. 4: Recommended location in X-Y plane
Fig. 5: Not recommended location in X-Y plane
Fig. 6: Recommended location in Z plane
Fig. 7: Not recommended location in Z plane
Fig. 8: Typical Solder Reflow Profile
Fig. 9: Package
FCC Warning
BD
E-R
F
M2
0
7P
Guangzhou
BDE
Technology
Inc.
Fig. 8: Typical S
older R
eflow Profile
Package Information
Fig. 9: Packag
e
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