Data Sheet
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Electronics
Multi-Band Wireless Module with PA
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Table Of Contents
General Description
Key Features
Applications
Contents
1. References
2. Pinout
3.1 Pin Attributes
3. Electrical Characteristics
4.1 Absolute maximum rating
4.2 Recommended operating conditions
4. Module Location
5. Dimensions
6. Typical Solder Reflow Profile
7. Package Information
8. Ordering Information
9. Revision History
10. FCC Warning
11. FCC Statements
12. Module statement
13. IC Statements
BDE-RFM208P-2.4
Multi-Band Wireless Module with P
A
Datashee
t
info@bdec
omm.com
BDE T
echnology
Inc.
11
/
15
6.
Typical Solder Reflow Profile
Figure 7-1. Ty
pical Solder Reflow Profile
7.
Package Information
Figure 8-
1.
P
ac
kage
1
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