Data Sheet

BDE-RFM208P-2.4
Multi-Band Wireless Module with PA
Datasheet
[e-mail]
BDE Technology Inc.
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Contents
General Description .......................................................................................................................................... 1
Key Features ..................................................................................................................................................... 1
Applications ...................................................................................................................................................... 3
Contents ............................................................................................................................................................ 4
1. References ................................................................................................................................................ 5
2. Pinout ....................................................................................................................................................... 6
3.1 Pin Attributes ...................................................................................................................................... 6
3. Electrical Characteristics ........................................................................................................................... 8
4.1 Absolute maximum rating ................................................................................................................... 8
4.2 Recommended operating conditions .................................................................................................. 8
4. Module Location....................................................................................................................................... 9
5. Dimensions ............................................................................................................................................. 10
6. Typical Solder Reflow Profile .................................................................................................................. 11
7. Package Information ............................................................................................................................... 11
8. Ordering Information ............................................................................................................................. 12
9. Revision History ...................................................................................................................................... 12
10. FCC Warning ................................................................................................................................... 13
11. FCC Statements .............................................................................................................................. 13
12. Module statement ......................................................................................................................... 14
13. IC Statements ................................................................................................................................. 15