Data Sheet

BDE Dual-Band WiFi MCU Module
Datasheet
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BDE Technology Inc.
BDE-WF3235
11 / 77
43
GND
–
Ground
Pin #
Pin Name
Type
(1)
Description
44
GPIO0
I/O
GPIO
(2)
45
NC
–
No Connect
46
GPIO1
I/O
GPIO
(2)
47
GPIO2
I/O
GPIO
(2)
48
GPIO3
I/O
GPIO
(2)
49
GPIO4
I/O
GPIO
(2)
50
GPIO5
I/O
GPIO
(2)
51
GPIO6
I/O
GPIO
(2)
52
GPIO7
I/O
GPIO
(2)
53
GPIO8
I/O
GPIO
(2)
54
GPIO9
I/O
GPIO
(2)
55
GND
–
Thermal ground
56
GND
–
Thermal ground
57
GND
–
Thermal ground
58
GND
–
Thermal ground
59
GND
–
Thermal ground
60
GND
–
Thermal ground
61
GND
–
Thermal ground
62
GND
–
Thermal ground
63
GND
–
Thermal ground
(1) I = input; O = output; I/O = bidirectional
(2) For pin multiplexing details, see Table 3-2.
The module makes extensive use of pin multiplexing to accommodate the large number of peripheral functions in
the smallest possible package. To achieve this configuration, pin multiplexing is controlled using a combination of
hardware configuration (at module reset) and register control.
The board and software designers are responsible for the proper pin multiplexing configuration. Hardware does not
ensure that the proper pin multiplexing options are selected for the peripherals or interface mode used. Table 3-2
describes the general pin attributes and presents an overview of pin multiplexing. All pin multiplexing options are
configurable using the pin MUX registers. The following special considerations apply:
• All I/Os support drive strengths of 2, 4, and 6 mA. Drive strength is individually configurable for each pin.
• All I/Os support 10-µA pullup and pulldown resistors.
• By default, all I/Os float in the Hibernate state. However, the default state can be changed by SW.
• All digital I/Os are non fail-safe.