Data Sheet

BDE Dual-Band WiFi MCU Module
Datasheet
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BDE Technology Inc.
BDE-WF3235
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Contents
General Description .......................................................................................................................................................... 1
Key Features ...................................................................................................................................................................... 1
Applications ....................................................................................................................................................................... 2
Device Family .................................................................................................................................................................... 3
Contents ............................................................................................................................................................................ 4
1. References ................................................................................................................................................................. 6
2. Block Diagram ........................................................................................................................................................... 7
3. Terminal Configuration and Functions ...................................................................................................................... 9
3.1 Pin Diagram ......................................................................................................................................................... 9
3.2 Pin Attributes and Pin Multiplexing .................................................................................................................... 9
3.3 Signal Descriptions ............................................................................................................................................ 25
3.4 Drive Strength and Reset States for Analog-Digital Multiplexed Pins ............................................................... 30
3.5 Pad State After Application of Power to Chip, but Before Reset Release ......................................................... 30
3.6 Connections for Unused Pins ............................................................................................................................ 31
4. Specifications .......................................................................................................................................................... 32
4.1 Absolute Maximum Ratings .............................................................................................................................. 32
4.2 ESD Ratings ........................................................................................................................................................ 33
4.3 Recommended Operating Conditions ............................................................................................................... 33
4.4 Brownout and Blackout Conditions................................................................................................................... 34
4.5 Electrical Characteristics for GPIO Pins ............................................................................................................. 36
4.5.1 Electrical Characteristics for Pin Internal Pullup and Pulldown (25°C) ................................................... 37
4.6 BLE and WLAN Coexistence Requirements ....................................................................................................... 38
4.7 Reset Requirement ............................................................................................................................................ 38
4.8Timing and Switching Characteristics ................................................................................................................. 38
4.8.1 Power-Up Sequencing ............................................................................................................................ 38
4.8.2 Power-Down Sequencing ....................................................................................................................... 39
4.8.3 Device Reset ........................................................................................................................................... 39
4.8.4 Wake Up From Hibernate Timing ........................................................................................................... 40
4.8.5 Peripherals Timing .................................................................................................................................. 41
5. Detailed Description ................................................................................................................................................ 52
5.1 Overview ........................................................................................................................................................... 52
5.2 Functional Block Diagram .................................................................................................................................. 52
5.3 Arm Cortex-M4 Processor Core Subsystem ...................................................................................................... 53
5.4 Wi-Fi Network Processor Subsystem................................................................................................................. 54
5.4.1 WLAN ..................................................................................................................................................... 54
5.4.2 Network Stack ........................................................................................................................................ 54
5.5 Security ............................................................................................................................................................. 56
5.6 Power-Management Subsystem ....................................................................................................................... 58
5.6.1 VBAT Wide-Voltage Connection ............................................................................................................. 58
5.7 Low-Power Operating Mode ............................................................................................................................. 59
5.8 Memory ............................................................................................................................................................. 61
5.8.1 Internal Memory .................................................................................................................................... 61
5.9 Restoring Factory Default Configuration ........................................................................................................... 63
5.10 Boot Modes ..................................................................................................................................................... 63
5.11 Hostless Mode ................................................................................................................................................. 65
6. Applications, Implementation, and Layout ............................................................................................................. 66
6.1 Typical Application .............................................................................................................................................. 66
6.1.1 BLE/2.4 GHz Radio Coexistence ............................................................................................................. 66
6.1.2 Typical Application Schematic ................................................................................................................ 67
6.2 Device Connection and Layout Fundamentals .................................................................................................. 69