Reference Manual
Table Of Contents
- Digi XBee® 3 RF Module Hardware Reference Manual
- General XBee 3 specifications
- IEEE 802.15.4-specific specifications
- Mechanical drawings
- Pin signals
- Design notes
- Regulatory information
- XBIB-C development boards
- Manufacturing information
- Troubleshooting
Design notes Design notes for PCB antenna and chip antenna devices
Digi XBee® 3 RF Module Hardware Reference Manual
33
n Do not place XBee 3 modules with the chip antenna or the embedded antenna inside a metal
enclosure.
n Do not place any ground planes or metal objects above or below the antenna.
n For the best results, mount the device at the edge of the host PCB. Ensure that the ground,
power, and signal planes are vacant immediately below the antenna section.
Design notes for PCB antenna and chip antenna devices
Position PCB/chip antenna devices so there are no ground planes or metal objects above or below the
antenna. For best results, do not place the device in a metal enclosure, as this may greatly reduce the
range. Place the device at the edge of the PCB on which it is mounted. Make sure the ground, power
and signal planes are vacant immediately below the antenna section.
The following drawings illustrate important recommendations when you are designing with PCB/chip
antenna devices. For optimal performance on the surface-mount device, do not mount the device on
the RF pad footprint described in the next section, because the footprint requires a ground plane
within the PCB antenna keepout area.
Surface-mount embedded antenna keepout area