Reference Manual
Table Of Contents
- Digi XBee® 3 RF Module Hardware Reference Manual
- General XBee 3 specifications
- IEEE 802.15.4-specific specifications
- Mechanical drawings
- Pin signals
- Design notes
- Regulatory information
- XBIB-C development boards
- Manufacturing information
- Troubleshooting
Design notes Copper keepout for test points
Digi XBee® 3 RF Module Hardware Reference Manual
38
Copper keepout for test points
The following keepouts are required for all surface-mount or micro-mount devices. These keepouts
are in addition to the other keepouts if using a PCB or chip antenna.
While the underside of the device is mostly coated with solder resist, we recommended the copper
layer directly below the device be left open to avoid unintended contacts. Copper or vias must not
interfere with the three exposed RF test points on the bottom of the device as shown in the following
diagrams. These devices have a ground plane in the middle on the back side for shielding purposes,
which can be affected by copper traces directly below the device.
Copper keepout for the XBee 3 surface-mount