Reference Manual

Digi XBee® 3 RF Module Hardware Reference Manual
5
Design notes
Power supply design 32
Board layout 32
Antenna performance 32
Design notes for PCB antenna and chip antenna devices 33
Surface-mount embedded antenna keepout area 33
XBee 3 Micro chip antenna keepout area 34
Through-hole embedded antenna keepout area 35
Design notes for RF pad devices 35
Copper keepout for test points 38
Regulatory information
United States (FCC) 41
OEM labeling requirements 41
FCC notices 41
FCC-approved antennas (2.4 GHz) 42
RF exposure 50
XBee 3 USB Adapter 50
FCC publication 996369 related information 50
Europe (CE) 51
Maximum power and frequency specifications 51
OEM labeling requirements 51
Declarations of conformity 52
Antennas 52
ISED (Innovation, Science and Economic Development Canada) 53
Labeling requirements 53
For XBee 3 53
RF Exposure 53
Australia (RCM)/New Zealand 54
Brazil ANATEL 54
Modelo: XBee 3 54
Japan (TELEC) 55
Mexico (IFETEL) 56
OEM labeling requirements 56
South Korea 56
XBIB-C development boards
XBIB-C Micro Mount reference 59
XBIB-C SMT reference 61
XBIB-CU TH reference 63
XBIB-C-GPS reference 65
Interface with the XBIB-C-GPS module 67
I2C communication 68
UART communication 68
Manufacturing information
Recommended solder reflow cycle 70
Handling and storage 70
Recommended footprint 70