Reference Manual
Table Of Contents
- Digi XBee® 3 RF Module Hardware Reference Manual
- General XBee 3 specifications
- IEEE 802.15.4-specific specifications
- Mechanical drawings
- Pin signals
- Design notes
- Regulatory information
- XBIB-C development boards
- Manufacturing information
- Troubleshooting
Manufacturing information
Digi XBee® 3 RF Module Hardware Reference Manual
69
Manufacturing information
The surface-mount and micro XBee 3 RF Module are designed for surface-mounting on the OEM PCB.
It has castellated pads to allow for easy solder attaching and inspection. The pads are all located on
the edge of the device so there are no hidden solder joints on these devices.
Recommended solder reflow cycle 70
Handling and storage 70
Recommended footprint 70
Flux and cleaning 72
Reworking 73