Reference Manual
Table Of Contents
- Digi XBee® 3 RF Module Hardware Reference Manual
- General XBee 3 specifications
- IEEE 802.15.4-specific specifications
- Mechanical drawings
- Pin signals
- Design notes
- Regulatory information
- XBIB-C development boards
- Manufacturing information
- Troubleshooting
Manufacturing information Flux and cleaning
Digi XBee® 3 RF Module Hardware Reference Manual
72
XBee 3 Micro recommended footprint
Match the solder footprint to the copper pads, but it may need to be adjusted depending on the
specific needs of assembly and product standards. Recommended stencil thickness is 0.15
mm/0.005”. Place the component last and set the placement speed to the slowest setting.
Flux and cleaning
Digi recommends that a “no clean” solder paste be used in assembling these devices. This eliminates
the clean step and ensures unwanted residual flux is not left under the device where it is difficult to
remove.
In addition the following issues can occur:
n Cleaning with liquids can result in liquid remaining under the shield or in the gap between the
device and the OEM PCB. This can lead to unintended connections between pads on the device.
n The residual moisture and flux residue under the device are not easily seen during an
inspection process.
Factory recommended best practice is to use a “no clean” solder paste to avoid these issues and
ensure proper device operation.