Reference Manual
Table Of Contents
- Digi XBee® 3 RF Module Hardware Reference Manual
- General XBee 3 specifications
- IEEE 802.15.4-specific specifications
- Mechanical drawings
- Pin signals
- Design notes
- Regulatory information
- XBIB-C development boards
- Manufacturing information
- Troubleshooting
Manufacturing information Reworking
Digi XBee® 3 RF Module Hardware Reference Manual
73
Reworking
Never perform rework on the device itself. The device has been optimized to give the best possible
performance, and reworking the device itself will void warranty coverage and certifications. We
recognize that some customers choose to rework and void the warranty. The following information
serves as a guideline in such cases to increase the chances of success during rework, though the
warranty is still voided.
The device may be removed from the OEM PCB by the use of a hot air rework station, or hot plate. Be
careful not to overheat the device. During rework, the device temperature may rise above its internal
solder melting point and care should be taken not to dislodge internal components from their
intended positions.