Reference Manual

General XBee 3 specifications General specifications
Digi XBee® 3 RF Module Hardware Reference Manual
9
General specifications
The following table describes the general specifications for the devices.
Specification
XBee 3/XBee 3-PRO
micro-mount
XBee 3/XBee 3-PRO
surface-mount
XBee 3/XBee 3-PRO
through-hole
Operating frequency
band
ISM 2.4 – 2.4835 GHz
Form factor Micro-mount Surface-mount Through-hole
Dimensions
Micro-mount: 1.36 cm x
1.93 cm x 0.241 cm (0.534
in x 0.760 in x 0.095 in)
Surface-mount: 2.199
x 3.4 x 0.368 cm (0.866
x 1.33 x 0.145 in)
Through-hole: 2.438
x 2.761 cm (0.960 x
1.087 in)
Operatingtemperature -40 to 85 °C (industrial)
Antenna options
RF pad, chip antenna, or
U.FL connector
RF pad, embedded
antenna, or U.FL
connector
RPSMA connector,
embedded antenna,
or U.FL connector
Analog-to-digital
converter (ADC)
4 10-bit analog inputs 4 10-bit analog inputs 4 10-bit analog
inputs
Regulatory conformity summary
This table describes the agency approvals for the devices.
Approval XBee 3 XBee 3-PRO
United States (FCC Part 15.247)
FCC ID: MCQ-XBEE3
FCC ID: MCQ-XBEE3
Innovation, Science and Economic Development
Canada (ISED)
IC: 1846A-XBEE3
IC: 1846A-XBEE3
FCC/IC Test Transmit Power Output range -6.8 to +8 dBm -6.8 to +19.9 dBm
Bluetooth® (XBee 3 Zigbee only) Declaration ID:
D042514
QDID: 121268
Declaration ID:
D042514
QDID: 121268
Australia RCM RCM
Brazil ANATEL 06329-18-
01209
ANATEL 06329-18-
01209
Europe (CE) Yes No
Japan (TELEC) R210-119309 No
Mexico (IFETEL) IFT #: RCPDIXB19-
1820
IFT #: RCPDIXB19-
1820
RoHS Compliant
South Korea (KCC) R-C-DIG-XBEE3 No