User's Manual

LTE Module BEC CBRS-12 User Manual
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Figure 42: Referenced Heatsink Design (Heatsink at the Backside of Customers’ PCB)
1. Make sure that customers’ PCB design provides sufficient cooling solutions for the module: proper
mounting, heatsinks, and active cooling may be required depending on the integrated application.
2. In order to protect the components from damage, the thermal design should be maximally optimized
to guarantee that the module’s internal temperature always maintains below 105°C. Customers can
execute AT+QTEMP command to get the module’s internal temperature.
3. For more detailed guidelines on thermal design, please refer to document [7].
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