User's Manual

LTE Module BEC CBRS-12 User Manual
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8.2. Manufacturing and Soldering
Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings
and then penetrate to the PCB. The force on the squeegee should be adjusted properly so as to produce a clean stencil
surface on a single pass. To ensure the module soldering quality, the thickness of stencil for the module should be
0.13-0.15mm. For more details, please refer to document [4].
It is suggested that the peak reflow temperature is 238ºC ~ 245ºC (for SnAg3.0Cu0.5 alloy). The absolute
max reflow temperature is 245ºC. To avoid damage to the module caused by repeated heating, it is
strongly recommended that the module should be mounted after reflow soldering for the other side of
PCB has been completed. Recommended reflow soldering thermal profile is shown below:
Figure 48: Reflow Soldering Thermal Profile
Table 43: Recommended Thermal Profile Parameters
Factor Recommendation
Soak Zone
Max slope 1 to 3°C/sec
Soak time (between A and B: 150°C and 200°C) 60 to 120 sec
Reflow Zone
Max slope 2 to 3°C/sec