Data Sheet

Surface Mount PTC
0ZCG Series
belfuse.com/circuit
-
protection
0ZCG Series
–
1812 Chip
RoHS 2 Compliant
Application
Operating (Hold Current) Range
All high
-
density boards
100mA
-
3A
Product Features
-
1812 Chip Size, Fas
t Trip Time,
Low DCR Resistance
-
AEC
-
Q
Compliant
-
Meets Bel automotive qualification*
*
-
Largely based on internal AEC
-
Q test plan
Maximum Voltage
Temperature Range
6
-
60V (per table)
-
40
℃
to 85
℃
Agency Approval
TUV (Std. EN60738
-
1
-
1, Cert. R50102117 & R50102187)
UL Recognized Component
(Std. UL1434, File E305051)
UL Conditions of Acceptability:
1. These devices have been investigated for use in safety circuits and are suitable
as a limiting d
evice.
2. These devices have been calibrated to limit the current to 8 amps within 5
seconds, per
ANSI/NFPA 70, “National Electrical Code”.
LEAD FREE =
HALOGEN FREE =
Electrical Characteristics (23
℃
)
Part Number
Hold
Current
Trip
Current
Rated
Voltage
Maximum
Current
Typical
Power
Max Time to Trip
Resistance Tolerance
Agency Approvals
Current
Time
Rmin
R1max
IH, A
IT, A
Vmax, Vdc
Imax, A
Pd, W
A
Sec
Ohms
Ohms
A
0ZCG0010FF2C
0.10
0.30
60
100
0.8
8.0
0.020
1.600
15.00
Y
Y
B
0ZCG0014FF2C
0.14
0.30
60
10
0.8
8.0
0.008
1.200
6.500
Y
Y
C
0ZCG0020FF2C
0.20
0.40
30
10
0.8
8.0
0.020
0.800
5.000
Y
Y
0ZCG0020AF2C
0.20
0.40
60
40
0.8
8.0
0.020
0.800
5.000
Y
Y
D
0ZCG0030FF2C
0.30
0.60
30
40
0.8
8.0
0.100
0.200
1.750
Y
Y
E
0ZCG0035FF2C
0.35
0.70
16
40
0.8
8.0
0.100
0.320
1.500
Y
Y
0ZCG0035AF2C
0.35
0.70
30
40
0.8
8.0
0.100
0.320
1.500
Y
Y
F
0ZCG0050FF2C
0.50
1.00
16
100
0.8
8.0
0.150
0.150
1.000
Y
Y
0ZCG0050AF2C
0.50
1.00
30
100
0.8
8.0
0.150
0.150
1.000
Y
Y
G
0ZCG0075FF2C
0.75
1.50
16
100
0.8
8.0
0.200
0.110
0.450
Y
Y
0ZCG0075AF2B
0.75
1.50
24
40
1.0
8.0
0.200
0.110
0.290
Y
Y
0ZCG0075BF2B
0.75
1.50
33
40
1.0
8.0
0.200
0.110
0.400
Y
Y
H
0ZCG0110FF2C
1.10
2.20
8
100
0.8
8.0
0.300
0.040
0.210
Y
Y
0ZCG0110AF2C
1.10
2.20
16
100
0.8
8.0
0.500
0.040
0.180
Y
Y
0ZCG0110BF2B
1.10
2.20
24
100
1.0
8.0
0.500
0.060
0.200
Y
Y
0ZCG0110CF2B
1.10
2.20
33
100
0.8
8.0
0.500
0.060
0.200
Y
I
0ZCG0125FF2C
1.25
2.50
6
100
0.8
8.0
0.400
0.050
0.140
Y
Y
0ZCG0125AF2B
1.25
2.50
16
100
0.8
8.0
0.400
0.050
0.140
Y
Y
J
0ZCG0150FF2C
1.50
3.00
8
100
0.8
8.0
0.500
0.040
0.110
Y
Y
0ZCG0150AF2C
1.50
3.00
12
100
1.0
8.0
0.500
0.040
0.110
Y
Y
0ZCG0150BF2C
1.50
3.00
24
100
1.0
8.0
1.500
0.040
0.120
Y
Y
K
0ZCG0160FF2C
1.60
3.20
8
100
0.8
8.0
0.500
0.030
0.100
Y
Y
0ZCG0160AF2C
1.60
3.20
12
100
1.0
8.0
1.000
0.030
0.100
Y
Y
0ZCG0160BF2C
1.60
3.20
16
100
1.0
8.0
1.000
0.030
0.100
Y
Y
L
0ZCG0200FF2C
2.00
3.50
8
100
1.0
8.0
2.000
0.020
0.070
Y
Y
0ZCG0200AF2B
2.00
3.50
16
100
1.0
8.0
5.000
0.020
0.085
Y
Y
M
0ZCG0260FF2C
2.60
5.00
8
100
1.0
8.0
2.500
0.015
0.047
Y
Y
0ZCG0260AF2B
2.60
5.00
13.2
100
1.3
8.0
5.000
0.015
0.050
Y
Y
0ZCG0260BF2B
2.60
5.00
16
100
1.3
8.0
5.000
0.015
0.050
Y
Y
N
0ZCG0300FF2B
3.00
5.00
6
100
1.0
8.0
4.000
0.012
0.040
Y
Y
I
H
Hold Current
-
maximum current at which the device will not trip in still air at 23
℃
.
I
T
Trip current
-
minimum current at which the device will always trip in still air at 23
℃
.
I
max
Maximum fault current device can withstand without damage at rated voltage (Vmax).
V
max
Maximum voltage device can withstand without damage a
t its rated current.
Pd
Typical power dissipated by device when in tripped state in 23
℃
still air en
vironment.
R
min
Minimum device resistance at 23
℃
.
R1
max
Maximum device resistance at 23
℃
, 1 hour after initial device trip, or after being soldered to PCB in end application.
Spe
cifications subject to change without notice
AEC
-
Q
Compliant