Datasheet

PRODUCT SPECIFICATION
REVISION: ECR/ECN NUMBER: DOCUMENT NUMBER SHEET No.
B
.1
EK2017-0028
PS-70094-001
7 of 11
DATE: CREATED / REVISED BY: CHECKED BY: APPROVED BY:
201
7
/
0
2
/
0
7
Kevin Miao
Ivanov
Wang
Ivanov
Wang
Form No.: QR-QP025-15 REV.: A
5.4 ENVIRONMENTAL REQUIREMENTS
Item
Test
Description
Test Method
Reference
Standard
15
Thermal Aging
Mate connectors; expose to:
240 hours at 105 ± 2°C or 500 hours at
85 ± 2°C
6 milliohms MAXIMUM
16
Humidity
(Steady State)
Mate connectors: expose to a temperature
of 40 ± 2°C with a relative humidity of 90-
95% for 96 hours.
Note: Remove surface moisture and air dry
for 1 hour prior to measurements.
6 milliohms MAXIMUM
&
Dielectric Withstanding
Voltage:
No Breakdown at 500
VAC
&
Insulation Resistance:
1000 Megohms
MINIMUM
17
Solder ability
Immerse the solder pin of the connector in
the solder bath at 260°C +/-5°C for 5+/-0.5
seconds After dipped the pin in the flux of
RAM or R type for 5 seconds MIL-STD-202
METHOD 208
Solder coverage:
95% MINIMUM
18
Solder Resistance
A) Wave Solder Process
Dip connector terminal tails in solder;
Solder Duration: 10 seconds MAX
Solder Temperature: 260°C MAX
B) Convection Reflow Solder Process
235°C MAX
Parts identified with a green dot on the
primary shipping carton label and all parts
with a manufacturing date after 11/1/2007:
260°C MAX
Visual :No Damage to
insulator material
19
Cold Resistance
Mate connectors:
Duration: 96 hours;
Temperature: -40 ± 3°C
6 milliohms MAXIMUM
20
Thermal Shock
Test cycles: 5cycles
Temperature range :
-55±3°C→30 minute
85±2°C→30 minute
No Damage