Datasheet

PRODUCT SPECIFICATION
REVISION:
ECR/ECN NUMBER:
DOCUMENT NUMBER
SHEET No.
1
EK2016-0203
PS-80210-001
8 of 8
DATE:
CREATED / REVISED BY:
CHECKED BY:
APPROVED BY:
2016 / 07/ 03
Kaysen Chen
Jerry Wang
Jerry Wang
TEMPLATE FILENAME: PRODUCT_SPEC REV 0.1,SHEET SIZE A4 20070830
7.0 IR PROFILE
Recommended Reflow Pre-Solder Process and Profile.
Actual reflow profile also depends on equipment, solder paste, PCB thickness, and other
components on the board. Please consult your solder paste & reflow equipment manufacturer for
their recommendations to adopt a suitable process.
Notes:
1. Reflow solder Preheat at 3°C/s to 150°C.
2. Reflow at 255°C for 30s per figure.
3. Peak temperature to be at 260 +0/-5°C.
260℃ Max for 10 seconds, 2 cycles(Peak Temperature)