Datasheet

PRODUCT SPECIFICATION
REVISION:
ECR/ECN NUMBER:
DOCUMENT NUMBER
SHEET No.
1
EK2016-0203
PS-80210-001
6 of 8
DATE:
CREATED / REVISED BY:
CHECKED BY:
APPROVED BY:
2016 / 07/ 03
Kaysen Chen
Jerry Wang
Jerry Wang
TEMPLATE FILENAME: PRODUCT_SPEC REV 0.1,SHEET SIZE A4 20070830
13
Shock
(Mechanical)
Mate connectors and shock at 50 g’s with
½sine wave (11 milliseconds) , 3 strokes in
the ±X, ±Y, ± Z axes
Per EIA-364-27, Condition A
Discontinuity1 μs MAX.
&
No physical damage
&
10 milliohms MAX.
(change from initial)
5.4 ENVIRONMENTAL REQUIREMENTS
ITEM
TEST DESCRIPTION
TEST CONDITION
REQUIREMENT
14
Thermal Shock
Mate connectors to follow condition for 10
cycles.
1 cycles
a). –55 +0/-3 ℃, 30 minutes
b)+25+10/-5 ℃, 5 minutes MAX.
c). 85 +3/-0 ℃ , 30 minutes
d) +25+10/-5 ℃ 5 minutes MAX.
Per EIA-364-32D, Test condition I
No physical damage
&
10 milliohms MAX.
(change from initial)
15
Cyclic temperature
and Humidity
Mate connectors to cycle the connector
between 25 ℃±3 ℃ at 80 % ±3 % RH
and 65 ℃±3 ℃ at 50 % ±3 % RH. Dwell
time of 1.0 hour; ramp time of 0.5 hours.
24 cycles
Per EIA-364-31B
No physical damage
&
10 milliohms MAX.
(change from initial)
16
Temperature life
Mate connectors to expose to 105 ± 2 ℃
for 120 hours.
Upon completion of the exposure period,
the test specimens shall be conditioned at
ambient room conditions for 1 to 2 hours,
after which the specified measurements
shall be performed.
Per EIA-364-17B, Test condition A
No physical damage
&
10 milliohms MAX.
(change from initial)
17
Salt Spray
The mated connectors shall be exposed to
the following salt mist conditions. At the
completion of the exposure period, salt
deposits shall be removed by a gentle
wash or dip in running water, after which
the specified measurements shall be
performed.
NaCl solution concentration: 5±1%, Spray
time: 48 hours, Temperature:35±2℃.
Per EIA-364-26B condition B
No physical damage
&
10 milliohms MAX.
(change from initial)
18
Solder Heat for
Rework/Repair
Connector to withstand PCB solder/re-
solder operation with hand held solder iron
at temperature of 350℃ minimum for a
dwell time of at least 3sec
No mechanical degradation
19
Solder Resistance
Receptacle connector: 2 cycles for IR
process (refer to 7.1 for profile.)
No physical damage or
discoloration of connector
materials.