Specifications

ST72104Gx, ST72215Gx, ST72216Gx, ST72254Gx
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14.2 THERMAL CHARACTERISTICS
Notes:
1. The power dissipation is obtained from the formula P
D
=P
INT
+P
PORT
where P
INT
is the chip internal power (I
DD
xV
DD
)
and P
PORT
is the port power dissipation determined by the user.
2. The average chip-junction temperature can be obtained from the formula T
J
= T
A
+ P
D
x RthJA.
Symbol Ratings Value Unit
R
thJA
Package thermal resistance (junction to ambient)
SDIP32
SO28
60
75
°C/W
P
D
Power dissipation
1)
500 mW
T
Jmax
Maximum junction temperature
2)
150 °C