Specifications

ST72104Gx, ST72215Gx, ST72216Gx, ST72254Gx
132/141
14.3 SOLDERING INFORMATION
In order to meet environmental requirements, ST
offers these devices in ECOPACK® packages.
These packages have a lead-free second level in
-
terconnect. The category of second level intercon-
nect is marked on the package and on the inner
box label, in compliance with JEDEC Standard
JESD97. The maximum ratings related to solder
-
ing conditions are also marked on the inner box la-
bel.
ECOPACK is an ST trademark. ECOPACK®
specifications are available at www.st.com.