User guide

200
400-560 Leader
Cover Film
The cover film peel strength force 0.1-0.7N
The cover film peel speed 300mm/min.
0.3±0.05
This print and information there in are proprietary to Bestar Electronics Industry Co., Ltd.
and shall not be used in whole or in part without its written content
Min.
1.5
6
REV.
A
B
C
240~280
Trailer160-200
100 0.5
13 0.2
5
Drawn
Date
Note
25.5
Date:
www.be-star.com [e-mail]
Approved by:
4
Drawn by:
Checked by:
3
Empty
330 Max
Diameter
33.5 Max
Dimensions of reel
Components
13.8±0.1
4.1 packing drawing
4. Tape on Reel Packing
D
E
F
G
Dimensions of carrier tape
12±0.1
1.5
+0.1
0
9.8±0.1
11.8±0.1
A A
4±0.1
2±0.1
24±0.1
1.75±0.1
11.5±0.1
B
B
B-B
0
0
100
50 150
100
Temperature [
℃
]
50
150
ramp up to
150℃
min.3k/s
min.110s
min.190 ℃
250200
time [s]
300 400350
ramp down
from T(solid)
min.6k/s
max.90s
BSP1109-05H1.7J LF
Piezo Sounder
2
Page:5 of 7
1
A
Unit:mm
B
C
2.0±0.1
max5
°
A-A
D
E
F
G
BSP1109-05H1.7J LF
6
3.10 Recommended Temp. Profile for Reflow Oven
H
Temperature profile for a lead-free reflow process
T(solid)min.217 ℃
300
250
min.300s
5
max.260 ℃
min.40s
max.255 ℃
4 3
H
2 1
DRG NO: BS/TEP01.646A
09/01/14
李红元
邱 俊
赵 峥
HPS0911A
JL NXX