Owner manual

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Fig. 1 Recommended soldering Temperature-Time profile (Reflow soldering)
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C
D
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B
C
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In automated mounting of The SMD Sound Transducers on printed circuit boards,any
bending,expanding and pulling forces or shocks against the SMD Sound Transducers shall
be kept minimum to preven them from electrical failures and mechanical damages of the
devices.
Soldering(Reflow)
(1)Solderings of The SMD Sound Transducers shall conform to the soldering conditions in
the individual specifications.
(2)The SMD Sound Transducers are designed for"Reflow Solderings"
(3)In the reflow solderings,too high soldering temperatures and too large tempearture
gradient such as rapid heating or cooling may cause electrical failures and mechanical
damages of the devices.
4.Surface Mounting Condition
Follwing soldering conditions are recommend;Refer to Fig.1
E
F
G
H
6 5 4 3 2 1
E
F
G
H
300
300
0
0
50
100
time [s]
200150 250 350 400
max.90s
min.40s
Temperature [
℃
]
ramp up to
150℃
min.3k/s
50
150
100
min.110s
min.300s
min.190℃
200
250
T(solid)min.217℃
max.260℃
ramp down
from T(solid)
min.6k/s
max.255℃
Temperature profile for a lead-free reflow process
Transducer
SMT1010-3.6H3.5-01 LF
DRG NO: BS/TET01.573A
魏奉玲
09/04/15
A
09/04/15
魏奉玲
徐 波
陶红仲
SMT1010-3.6H3.5-01 LF