Owner manual

min.110s
50
150
100
200
Temperature [
℃
]
ramp up to
150℃
min.3k/s
50
0
0
100
min.190℃
time [s]
200150 250
ramp down
from T(solid)
min.6k/s
350300 400
max.90s
Temperature profile for a lead-free reflow process
min.300s
250
300
max.260℃
T(solid)min.217℃
max.255℃
min.40s
123456
H
G
F
E
H
G
F
E
Follwing soldering conditions are recommend;Refer to Fig.1
5.Surface Mounting Condition
D
C
B
Checked by:
Drawn by:
Date:
D
C
B
Fig. 1 Recommended soldering Temperature-Time profile (Reflow soldering)
Page:06 of 09
12
Approved by:
4 3
Note
Drawn
5
www.be-star.com [e-mail]
Date
REV.
6
BESTAR ELECTRONICS INDUSTRY CO.,LTD
A A
Transducer
This print and information there in are proprietary to Bestar Electronics Industry Co., Ltd.
and shall not be used in whole or in part without its written content
SMT5050-03H03-02 LF
SMT5050-03H03-02 LF
Notice: After reflow soldering test the part shall meet specifications without any
degrance and performance except S.P.L, S.P.L shall be 76dB or more.
博 士 達
A
08/03/07
徐 波
陶红仲
DRG NO: BS/TET01.530B
B
09/08/06 魏奉玲
高 正
魏奉玲
09/08/06
characteric
standardized
In automated mounting of The SMD Sound Transducers on printed circuit boards, any
bending, expanding and pulling forces or shocks against the SMD Sound Transducers shall
be kept to a minimum to prevent them from electrical failures and mechanical damages of
the devices
Soldering(Reflow)
(1)Soldering of The SMD Sound Transducers shall conform to the soldering conditions in
the individual specifications.
(2)The SMD Sound Transducers are designed for "Reflow Soldering" under the
recommended solder profile
(3)SMD Sound Transducers which during the reflow soldering process are exposed to too
high soldering temperatures and/or too large temperature gradient such as rapid heating or
cooling may lead to electrical failures and mechanical damages of the devices.