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TE CONNECTIVITY SENSORS /// MS5837-02BA REV A8 12/2019

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MS5837-02BA

Gel-filled, ultra-compact, water resistant

digital pressure and temperature sensor

Take your devices to the next level with our MS5837-02BA

pressure and temperature sensor module. This ultra-compact

(3.3 x 3.3 x 2.75 mm), gel-filled sensor is optimized for

consumer devices such as fitness trackers, drones and

wearables, providing a robust sensor package to withstand the

harsh environments often encountered in these applications.

Expanding on TE Connectivity's (TE) MS5837 series of ultra-

compact, digital altimeters, our 2 bar models offers options for

shielding and high chemical endurance.

This MEMS based sensor includes a high-linearity pressure

sensor with low power (0.6µA), 24-bit digital output (I

C) and an

altitude resolution at sea level of 13 cm. This enables high

resolution measurements such as counting flights of stairs. The

board level design delivers sensing accuracy for both pressure

(±0.5mbar) and temperature (±2ºC) measurements. Lid shield

option reduces signal noise and interference that may be

experienced with sensors installed in plastic housings or high

electrical noise environments with integrated shielding.

(Non-shielded models should only be recommended for use in

applications with metal housings.)

Our MS5837-02BA provides exceptional performance, reliability

and accurate performance from a brand you can trust.

FEATURES

 Ceramic and metal package: 3.3 x 3.3 x 2.75mm

 High resolution module: 13 cm

 Supply voltage: 1.5 to 3.6 V

 Low power: 0.6 µA (standby ≤ 0.1 µA at 25°C)

 Integrated digital pressure sensor (24 bit ΔΣ ADC)

 Operating range: 300 to 1,200 mbar, -20 to +85 °C

 I

C interface

 No external components (internal oscillator)

 Water resistant sealing with 1.8 x 0.8mm O-ring

 Shielded metal lid option

APPLICATIONS

 Fitness Trackers

 Drones

 Bike Computers

 Mobile Altimeter/Barometer Systems

 E-cigarettes

 Wearables

Summary of content (17 pages)

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MS5837-02BA Gel-filled, ultra-compact, water resistant digital pressure and temperature sensor Take your devices to the next level with our MS5837-02BA pressure and temperature sensor module. This ultra-compact (3.3 x 3.3 x 2.75 mm), gel-filled sensor is optimized for consumer devices such as fitness trackers, drones and wearables, providing a robust sensor package to withstand the harsh environments often encountered in these applications.
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MS5837-02BA Gel-filled, ultra-compact, water resistant digital pressure and temperature sensor PREFORMANCE SPECIFCIATIONS ABSOLUTE MAXIMUM RATINGS Parameter Supply voltage Storage temperature Overpressure Maximum Soldering Temperature (2) ESD rating (lid to GND version) Symbol VDD TS Pmax Conditions Tmax (2) ISO 22810(1) Max +4 +85 10 Unit V °C bar 40 sec. max 250 °C -2 +2 kV -100 +100 mA Typ. 3.0 +25 20.09 10.05 5.02 2.51 1.26 0.63 1.25 Max 3.6 +85 Unit V °C 0.01 0.
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MS5837-02BA Gel-filled, ultra-compact, water resistant digital pressure and temperature sensor PERFORMANCE SPECIFICATIONS (Continued) PRESSURE OUTPUT CHARACTERISTICS (VDD = 3 V, T = 25°C UNLESS OTHERWISE NOTED) Parameter Operating Pressure Range Extended Pressure Range Relative Accuracy (1) (4) Resolution RMS Maximum error with supply voltage (2) Long-term stability Reflow soldering impact Conditions Prange Linear Range of Pext ADC 600...1000 mbar, at 20°C 300...1100 mbar, 0...60°C 300...
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MS5837-02BA Gel-filled, ultra-compact, water resistant digital pressure and temperature sensor TYPICAL PERFORMANCE CHARACTERISTICS RELATIVE PRESSURE ERROR AND TEMPERATURE ERROR VS PRESSURE AND TEMPERATURE (TYPICAL VALUES) TE CONNECTIVITY SENSORS /// MS5837-02BA REV A8 12/2019 Page 4
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MS5837-02BA Gel-filled, ultra-compact, water resistant digital pressure and temperature sensor TYPICAL PERFORMANCE CHARACTERISTICS RELATIVE PRESSURE AND TEMPERATURE ERROR VS TEMPERATURE (1ST ORDER AND 2ND ORDER ALGORITHM, TYPICAL VALUES) RELATIVE PRESSURE AND TEMPERATURE ERROR VS POWER SUPPLY (TYPICAL VALUES) TE CONNECTIVITY SENSORS /// MS5837-02BA REV A8 12/2019 Page 5
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MS5837-02BA Gel-filled, ultra-compact, water resistant digital pressure and temperature sensor PRESSURE AND TEMPERATURE CALCULATION GENERAL The MS5837 consists of a piezo-resistive sensor and a sensor interface integrated circuit. The main function of the MS5837 is to convert the uncompensated analogue output voltage from the piezo-resistive pressure sensor to a 24-bit digital value, as well as providing a 24-bit digital value for the temperature of the sensor.
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MS5837-02BA Gel-filled, ultra-compact, water resistant digital pressure and temperature sensor PRESSURE AND TEMPERATURE CALCULATION Start Maximum values for calculation results: PMIN = 10mbar P MAX = 2000mbar TMIN = -40°C T MAX = 85°C T REF = 20°C Read calibration data (factory calibrated) PROMof W1 to W4) Convert calibration data into coefficients (see from bit pattern [1] Value Recommended variable type Size [bit] min max Example / Typical Pressure sensitivity | SENS T1 unsigned int 16 16 0
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MS5837-02BA Gel-filled, ultra-compact, water resistant digital pressure and temperature sensor SECOND ORDER TEMPERATURE COMPENSATION The results of the last first order calculation are entered in the following chart to obtain the pressure and temperature compensated with the 2nd order: P2 and TEMP2.
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MS5837-02BA Gel-filled, ultra-compact, water resistant digital pressure and temperature sensor I2C INTERFACE COMMANDS The MS5837 has only five basic commands: 1. Reset 2. Read PROM (112 bit of calibration words) 3. D1 conversion 4. D2 conversion 5. Read ADC result (24 bit pressure / temperature) Each I2C communication message starts with the start condition and it is ended with the stop condition. The MS5837 address is 1110110x (write: x=0, read: x=1).
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MS5837-02BA Gel-filled, ultra-compact, water resistant digital pressure and temperature sensor RESET SEQUENCE The Reset sequence shall be sent once after power-on to make sure that the calibration PROM gets loaded into the internal register. It can be also used to reset the device PROM from an unknown condition. The reset can be sent at any time. In the event that there is not a successful power on reset this may be caused by the SDA being blocked by the module in the acknowledge state.
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MS5837-02BA Gel-filled, ultra-compact, water resistant digital pressure and temperature sensor CONVERSION SEQUENCE The conversion command is used to initiate uncompensated pressure (D1) or uncompensated temperature (D2) conversion. After the conversion, using ADC read command the result is clocked out with the MSB first. If the conversion is not executed before the ADC read command, or the ADC read command is repeated, it will give 0 as the output result.
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MS5837-02BA Gel-filled, ultra-compact, water resistant digital pressure and temperature sensor Version PROM Word 0 programming For product type, the bits [11:5] of memory address 0 must be programmed with the following fixed values: MS5837-02BA01 Address 0 15 14 crc 13 12 11 0 10 0 9 0 8 0 7 0 6 0 5 0 4 3 2 1 factory settings 0 13 12 11 0 10 0 9 1 8 0 7 1 6 0 5 1 4 3 2 1 factory settings 0 MS5837-02BA21 Address 0 15 14 crc TE CONNECTIVITY SENSORS /// MS5837-02BA REV A8 12/
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MS5837-02BA Gel-filled, ultra-compact, water resistant digital pressure and temperature sensor CYCLIC REDUNDANCY CHECK (CRC) MS5837 contains a PROM memory with 112-Bit. A 4-bit CRC has been implemented to check the data validity in memory.
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MS5837-02BA Gel-filled, ultra-compact, water resistant digital pressure and temperature sensor APPLICATION CIRCUIT The MS5837 is a circuit that can be used in conjunction with a microcontroller in mobile altimeter applications. Figure: Typical application circuit PIN CONFIGURATION AND DEVICE PACKAGE OUTLINE UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS. GENERAL TOLERANCE ± 0.
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MS5837-02BA Gel-filled, ultra-compact, water resistant digital pressure and temperature sensor RECOMMENDED PAD LAYOUT Pad layout for bottom side of the MS5837-30BA soldered onto printed circuit board.
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MS5837-02BA Gel-filled, ultra-compact, water resistant digital pressure and temperature sensor MOUNTING AND ASSEMBLY CONSIDERATIONS SOLDERING Please refer to the application note AN808 available on our website for soldering recommendations. MOUNTING The MS5837 can be placed with automatic Pick & Place equipment using vacuum nozzles. It will not be damaged by the vacuum. Due to the low stress assembly, the sensor does not show pressure hysteresis effects. It is important to solder all contact pads.
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MS5837-02BA Gel-filled, ultra-compact, water resistant digital pressure and temperature sensor ORDERING INFORMATION PART NUMBER DESCRIPTION MS583702BA01-50 MS5837-02BA01 2BA T&R PRESSURE SEN 20000979-00 MS5837-02BA21 2BA LS T&R PRESSURE SEN NORTH AMERICA SHIELDING EUROPE Tel +1 800 522 6752 customercare.frmt@te.com Tel +31 73 624 6999 customercare.bevx@te.com X ASIA Tel +86 0400 820 6015 customercare.shzn@te.com te.