Data Sheet

ManualsBrandsBlueRobotics ManualsUUV / ROV PartsBar30 High-Resolution 300m Depth/Pressure Sensor (PCB)

SENSOR SOLUTIONS /// MS5837-30BA

03/12/2015

MS5837-30BA

Ultra Small Gel Filled Pressure Sensor

SPECIFICATIONS

 Ceramic - metal package, 3.3 x 3.3 x 2.75mm

 High-resolution module 0.2 mbar

 Fast conversion down to 0.5 ms

 Low power, 0.6 µA (standby < 0.1 µA at 25°C)

 Integrated digital pressure sensor (24 bit ΔΣ ADC)

 Supply voltage 1.5 to 3.6 V

 Operating range: 0 to 30 bar, -20 to +85 °C

 I

C interface

 No external components (Internal oscillator)

 Excellent long term stability

 Hermetically sealable for outdoor devices

 Sealing designed for 1.8 x 0.8mm O-ring

The MS5837-30BA is a new generation of high resolution

pressure sensors with I

C bus interface for depth

measurement systems with a water depth resolution of 2 mm.

The sensor module includes a high linearity pressure sensor

and an ultra-low power 24 bit ΔΣ ADC with internal factory

calibrated coefficients. It provides a precise digital 24 Bit

pressure and temperature value and different operation modes

that allow the user to optimize for conversion speed and

current consumption. A high resolution temperature output

allows the implementation in depth measurement systems and

thermometer function without any additional sensor. The

MS5837-30BA can be interfaced to virtually any

microcontroller. The communication protocol is simple, without

the need of programming internal registers in the device. The

gel protection and antimagnetic stainless steel cap make the

module water resistant. This new sensor module generation is

based on leading MEMS technology and latest benefits from

MEAS Switzerland proven experience and know-how in high

volume manufacturing, which has been widely used for over a

decade.

Summary of content (16 pages)

PAGE 1
MS5837-30BA Ultra Small Gel Filled Pressure Sensor SPECIFICATIONS             Ceramic - metal package, 3.3 x 3.3 x 2.75mm High-resolution module 0.2 mbar Fast conversion down to 0.5 ms Low power, 0.6 µA (standby < 0.1 µA at 25°C) Integrated digital pressure sensor (24 bit ΔΣ ADC) Supply voltage 1.5 to 3.
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MS5837-30BA Ultra Small Gel Filled Pressure Sensor PERFORMANCE SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS Parameter Supply voltage Storage temperature Overpressure Maximum Soldering Temperature Symbol VDD TS Pmax Conditions Tmax Min. -0.3 -40 ISO 22810 Max +4 +85 50 Unit V °C Bar 40 sec max 250 °C -2 +2 kV -100 +100 mA Typ. 3.0 +25 20.09 10.05 5.02 2.51 1.26 0.63 1.25 0.01 470 Max 3.6 +85 Unit V °C Typ. 24 16.44 8.22 4.13 2.08 1.06 0.
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MS5837-30BA Ultra Small Gel Filled Pressure Sensor PERFORMANCE SPECIFICATIONS (CONTINUED) PRESSURE OUTPUT CHARACTERISTICS (V DD = 3 V, T = 25°C UNLESS OTHERWISE NOTED ) Parameter Operating Pressure Range Absolute Accuracy (1), Temperature range: 0 … 40°C Absolute Accuracy (1), Temperature range: -20 … 85°C Maximum error with supply voltage (2) Long-term stability Resolution RMS Reflow soldering impact Conditions Prange 0 … 6 bar 0 … 20 bar 0 … 30 bar 0 … 6 bar 0 … 20 bar 0 … 30 bar Full Accuracy Min.
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MS5837-30BA Ultra Small Gel Filled Pressure Sensor PERFORMANCE SPECIFICATIONS (CONTINUED) DIGITAL INPUTS (SCL, SDA) Parameter Serial data clock Input high voltage Input low voltage Input leakage current Symbol SCL VIH VIL Ileak25°C Conditions Min. Parameter Output high voltage Symbol VOH Conditions Isource = 0.6 mA Min. 80% VDD Output low voltage VOL Isink 0% VDD Typ. Max 400 100% VDD 20% VDD 0.1 Unit kHz V V µA Typ.
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MS5837-30BA Ultra Small Gel Filled Pressure Sensor PERFORMANCE CHARACTERISTICS PRESSURE ERROR VS PRESSURE AND TEMPERATURE TEMPERATURE ERROR VS PRESSURE AND TEMPERATURE PRESSURE AND TEMPERATURE ERROR VS POWER SUPPLY SENSOR SOLUTIONS /// MS5837-30BA 03/12/2015 5
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MS5837-30BA Ultra Small Gel Filled Pressure Sensor FUNCTIONAL DESCRIPTION GENERAL The MS5837-30BA consists of a piezo-resistive sensor and a sensor interface IC. The main function of the MS5837-30BA is to convert the uncompensat ed analogue out put voltage from the piezo -resistive pressure sensor to a 24-bit digital value, as well as providing a 24-bit digital value for the temperature of the sensor.
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MS5837-30BA Ultra Small Gel Filled Pressure Sensor PRESSURE AND TEMPERATURE CALCULATION Start Maximum v alues f or calculation results: PMIN = 0 bar PMAX = 30 bar T MIN = -20°C TMAX = 85°C TREF = 20°C Convert calibration data data into coefficients (see bit pattern W1 to W4) Read calibration (factory calibrated) fromofPROM [1] Recommended Size variable type [bit] Variable Description | Equation Value min max Example / Typical C1 Pressure sensitiv ity | SENST1 unsigned int 16 16 0 65535 34982
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MS5837-30BA Ultra Small Gel Filled Pressure Sensor SECOND ORDER TEMPERATURE COMPENSATION Pressure and Temperature parameters values first order: OFF, SENS and TEMP Yes No (TEMP/ 100)< 20°C Low temperature Low temperature High temperature Ti = 3  dT / 2 2 Ti = 2  dT2 / 237 33 OFFi = 1  (TEMP – 2000)2 / 24 SENSi = 0 OFFi = 3  (TEMP – 2000) / 2 SENSi = 5  (TEMP – 2000)2 / 23 2 1 No Yes (TEMP/ 100) < -15°C Very low temperature OFFi = OFFi + 7  (TEMP + 1500) 2 SENSi = SENSi + 4  (TEMP + 15
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MS5837-30BA Ultra Small Gel Filled Pressure Sensor I2C INTERFACE COMMANDS The MS5837-30BA has only five basic commands: 1. Reset 2. Read PROM (112 bit of calibration words) 3. D1 conversion 4. D2 conversion 5. Read ADC result (24 bit pressure / temperature) 2 Each I C communication message starts with the start condition and it is ended with t he stop condition. The MS5837-30BA address is 1110110x (write: x=0, read: x=1). Size of each command is 1 byte (8 bits) as described in the table below.
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MS5837-30BA Ultra Small Gel Filled Pressure Sensor RESET SEQUENCE The Res et sequenc e shall be sent once after power-on to make sure that the calibration PROM gets loaded into the internal register. It can be also used to reset the device PROM from an unknown condition. The reset can be sent at any time. In the event that there is not a successful power on res et this may be caused by the SDA being blocked by the module in the acknowledge state.
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MS5837-30BA Ultra Small Gel Filled Pressure Sensor CONVERSION SEQUENCE The conversion command is used to initiate uncompensated pressure (D1) or uncompensated temperature (D2) conversion. After the conversion, using ADC read command the result is clocked out with the MSB first. If the conversion is not executed before the ADC read command, or the ADC read command is repeated, it will give 0 as the output result.
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MS5837-30BA Ultra Small Gel Filled Pressure Sensor CYCLIC REDUNDANCY CHECK (CRC) MS5837-30BA contains a PROM memory with 112 -Bit. A 4-bit CRC has been implemented to check the data validity in memory. The besides C code describes in detail CRC-4 calculation.
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MS5837-30BA Ultra Small Gel Filled Pressure Sensor APPLICATION CIRCUIT The MS5837 is a circuit that can be used in conjunction with a microcontroller in mobile altimeter applications. Typical application circuit PIN CONFIGURATION AND DEVICE PACKAGE OUTLINE UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS. GENERAL TOLERANCE ± 0.
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MS5837-30BA Ultra Small Gel Filled Pressure Sensor RECOMMENDED PAD LAYOUT Pad layout for bottom side of the MS5837-30BA soldered onto printed circuit board.
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MS5837-30BA Ultra Small Gel Filled Pressure Sensor MOUNTING AND ASSEMBLY CONSIDERATIONS SOLDERING Please refer to the application note AN808 available on our website for all soldering recommendations. MOUNTING The MS5837-30BA can be placed with automatic Pick & Place equipment using vacuum nozzles. It will not be damaged by the vacuum. Due to the low stress assembly the sensor does not show pressure hysteresis effects. It is important to solder all contact pads.
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MS5837-30BA Ultra Small Gel Filled Pressure Sensor ORDERING INFORMATION Part Number / Art.