Specifications
TOP
CHASSIS
WIRING
1. ( ) Fig. 5 . Strip the
outer
insulation of one end of
the
4 conductor
cable
back 1 3
/4"
. Unwrap
the
outer
shield and twist shield stronds.
Cut
the
outer
shield to
1/
2",
the
brown lead to 3
/4",
the
red lead to 1" and the yellow
lead
to 1
1/
4" .
Connect
the shield wire to
SI-78
(C),
the
brown
lead
to SI-6AB (S),
the red lead
toSI-5AB(S),
the orange lead to SI -11B (S) and the yellow lead
to
SI-8B
(S). Push
the
remainder of
the
shielded
lead
through the
rectangular
hole
unde r the switch to the bottom of the chassis.
2.
( ) Fig. 5 . Strip
the
outer
insulation of
one
end of a 3 1
/2"
piece
of
single conductor
shielded
wire
back
1".
Unwrap the
outer
shield and twist
shield strands.
Cut
the
outer
shield to
1/
2" .
Connect
the shield wire to S1-7B
(C) and the inner
conductor
to S1-lOB (S). Push the remainder
of
the shielded
lead through the
rectangularhole
under the switch to the bottom of the chassis.
3.
( ) Fig. 5.
Connect
a 2"
piece
of bare
wire
covered with 1 1
/2"
of
spa-
ghetti
fram
SI-78
(S) to
SI-2B
(S).
10.
( ) Fig . 5 . Conn
ect
a
90KQ(white,
black,
orange,
gold)5%
resistor,
R9,
and on 850mmf disc
ceramic
copacitor,
C4,
from Sl - 2A (S) to TB8-2 (C) .
Cut
a II Ieods to
1".
11. ( ) Fig. 5.
Connect
a
lMQ
(brown,black,
green,
silver)
10% resistor, R8,
and a 3000mmf disc
ceramic
capacitor,
C3,
from
SI-9A(S)
to TB8-2(S).
Cut
all leads to 1" .
12. (
)Fig
.
5.
Connectoneendofa21
/2"pieceofgreenwiretoRII-2(S).
Push the remainder of the
wire
through
hole"X"
near
Rll
to the bottom of the
chassis.
13. ( ) Fig.
5.
Connect
one end of a 4"
piece
of green wire to
TB7
(C).
Push
the remainder of
the
wire
through hoi e "Y"
near
R12 to the bottom of
the
chassis.
14. ( ) Fig. 5.
Connect
one
end of a 5"
piece
of
yellow
wire to R13-
'1
(C).
Push
the
remainder of
the
wire through hole
"Y"
near
R12 to
the
bottom of the
chassis.
15. ( ) Fig. 5.
Connect
the
black
lead
that
passes through
hole
llyn to
R13-3
(C).
16. ( ) Fig. 5.
Cut
and
connect
the
leads on
the
printed
circuit
board PC1,
in
the
prescribed
sequence
as follows. Put
21/4"
of
spaghetti
on
lead
1; 1
1/2"
of
spaghetti
on
lead
4; 1" of
spaghetti
on
lead
5 and 2"
of
spaghetti
on
lead
7.
4 . ( ) Fig .
5.
5trip
the
outer
insulation of one
endofa
41/2"
pieceofsingle
conductor
shielded
wire
back
1/
2" . Unwrap
the
shield and
cut
off.
St;ip
the
insulation of the
inner
conductor
back
1/
4" and
connect
to S1-8A (S). Strip
::
the
outer
insulation on
the
other
end
back
3
/4"
. Unwrap the
outer
shield and
n twist shield strands. Strip
the
insulation of
the
inner conductor
back
1/4"
and
connect
to TB12 (C) .
Cut
the
shield strands to
1/
2" and
connect
to R11-3 (C) .
5. ( ) Fig. 5.
Connect
a 3"
piece
of
black
wire to
RII-3
(S). Push
the
re-
mainder through
hole
"X".
6.
( ) Fig.
5.
Connect
one
end of a 2"
piece
of
green
wire
to S1-4AB (5).
Push the rest of
the
lead through the
rectangular
cutout
under the switch to
the
bottom of the chassis.
#6
(1/2")
to R12-3 (S)
#3
(3/4")
to R12-2 (S)
'2
(1/2")
to R12-1 (5)
#1 (2
1/2")
to R13-3 (S)
#7 (2
1/4")
to R13-1 (5)
#4 (1
3/4")
to R13-2 (5)
#5 (1
1/4")
to TB7 (S)
7 . ( ) Fig. 5 .
Connect
one
end of a '4"
piece
of
yellow
wire
to
SI-1A
(5) .
Running lead as shown, push
the
restof
the lead through the
rectangular
cutout
under the switch to the bottom of the chassis.
8. ( ) Fig. 5.
Connect
a 850mmf disc
ceramic
capacitor,
C6,
from S1-3A
(S) to
TB8-1
(C).
Cut
both leads to
I".
9. ( ) Fig. 5 .
Connect
a 68KQ
(blue,
grey,
orange,
gold) 5% resistor, R33,
fromSI-12A(S)
toT88-1 (S).
Cut
both leads to
l"and
cover
each
with a 3
/4"
piece
of
spaghetti.
17. ( ) Fig. 5.
Connect
the
. 03mfd molded
capacitor,
C16, from S2-1 (C)
to ground lug
"I"
(S).
Cut
both leads to 1
1/2".
Cover
the
lead
going
to
S2-1 with 1
1/4"
spaghetti.
18. ( ) Fig. 5.
Cut
both leads on a 56KQ (green,
blue,
orange,
silver)
resistor,
R34, to
1/
2".
Connect
from TB12 (S) to
Rll-1
(S).