User's Manual

Table Of Contents
Replacement device. Implanting a replacement device in a subcutaneous pocket that previously housed
a larger device may result in pocket air entrapment, migration, erosion, or insufcient grounding between
the device and tissue. Irrigating the pocket with sterile saline solution decreases the possibility of
pocket air entrapment and insufcient grounding. Suturing the device in place reduces the possibility of
migration and erosion.
Do not bend the lead near the lead-header interface. Insert the lead terminal straight into the lead
port. Do not bend the lead near the lead-header interface. Improper insertion can cause insulation
or connector damage.
Absence of a lead. The absence of a lead or plug in a lead port may affect device performance. If a
lead is not used, be sure to properly insert a plug in the unused port, and then tighten the setscrew
onto the plug.
Electrode connections. Do not insert a lead into the pulse generator connector without taking the
following precautions to ensure proper lead insertion:
Insert the torque wrench into the preslit depression of the seal plug before inserting the lead into t he
port, to release any trapped uid or air.
Visually verify that the setscrew is sufciently retracted to allow insertion. Use the torque wrench
to loosen the setscrew if necessary.
Fully insert each lead into its lead port and then tighten the setscrew onto the terminal pin.
•Debrillation lead impedance. If total shocking lead impedance during implant is less than 20 ,verify
the proximal coil is not in contact with the pulse generator surface. A measurement of less than 20 is
an indication of a short somew here in the system. If repeated measurements show the total shocking
lead impedance is less than 20 , the lead and/or pulse generator may need to be replaced.
Shunting energy. Do not allow any object that is electrically conductive to come into contact with the
lead or device during induction because it m ay shunt energy, resulting in less energy getting to the
patient, and may damage the implanted system.
9