Datasheet

CW252016 Series - High Q Chip Inductors
REV. 01/17
10.0
(.393)
12.5
(.492)
2.0 ± 0.5
(.079 ± .020)
50.0
(1.969)
178.0
(7.00)
DIA.
13.0 ± 0.5
(.512 ± .020)
DIA.
13.0 ± 0.5
(.512 ± .020)
DIA.
21.0 ± 0.8
(.827 ± .031)
EMBOSSED
CARRIER
EMBOSSED
CAVITY
0.10
(.004)
THICKNESS
MAX.
8.0
(.315)
DIMENSIONS:
MM
(INCHES)
Peak Temperature:
260 °C max.
Time Above 230 °C:
50 sec. max.
Time Above 200 °C:
70 sec. max.
250
Temperature (°C)
0
50
50
200
150
100
+4.0 °C / sec. max. 150~200 °C / 60~120 sec. -(1.0~5.0) °C / sec. max.
Temperature
Rising Area
Preheat Area Reflow Area Forced Cooling Area
200
Time (Seconds)
100 150
70 sec. max.
230 °C
250
+2.0~4.0 °C /
sec. max.
50 sec. max.
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at
www.bourns.com/docs/legal/disclaimer.pdf.
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