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Datasheet

ManualsBrandsBOURNS ManualsFusesPTC fuse Current I(H) 0.1 A 30 V (L x W x H) 3.43 x 2.8 x 1.1 mm 1 pc(s)
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Specifi cations are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specifi c applications.
MF-USMF Series - PTC Resettable Fuses
Product Dimensions
DIMENSIONS:
MM
(INCHES)
Model
ABCD
Min. Max. Min. Max. Min. Max. Min.
MF-USMF005
3.00
(0.118)
3.43
(0.135)
2.35
(0.093)
2.80
(0.110)
0.80
(0.031)
1.1
(0.043)
0.30
(0.012)
MF-USMF010
3.00
(0.118)
3.43
(0.135)
2.35
(0.093)
2.80
(0.110)
0.80
(0.031)
1.1
(0.043)
0.30
(0.012)
MF-USMF020
3.00
(0.118)
3.43
(0.135)
2.35
(0.093)
2.80
(0.110)
0.80
(0.031)
1.1
(0.043)
0.30
(0.012)
MF-USMF035
3.00
(0.118)
3.43
(0.135)
2.35
(0.093)
2.80
(0.110)
0.55
(0.022)
0.85
(0.033)
0.30
(0.012)
MF-USMF050
3.00
(0.118)
3.43
(0.135)
2.35
(0.093)
2.80
(0.110)
0.55
(0.022)
0.85
(0.033)
0.30
(0.012)
MF-USMF075
3.00
(0.118)
3.43
(0.135)
2.35
(0.093)
2.80
(0.110)
0.55
(0.022)
0.85
(0.033)
0.30
(0.012)
MF-USMF110
3.00
(0.118)
3.43
(0.135)
2.35
(0.093)
2.80
(0.110)
0.55
(0.022)
0.85
(0.033)
0.30
(0.012)
MF-USMF150
3.00
(0.118)
3.43
(0.135)
2.35
(0.093)
2.80
(0.110)
0.40
(0.016)
0.85
(0.033)
0.30
(0.012)
MF-USMF175X
3.00
(0.118)
3.43
(0.135)
2.35
(0.093)
2.80
(0.110)
0.40
(0.016)
0.85
(0.033)
0.30
(0.012)
Packaging: 3000 pcs. per reel.
Terminal material:
Electroless Ni under immersion Au
Termination pad solderability:
Standard Au fi nish:
Meets ANSI/J-STD-002 Category 2.
Recommended Storage:
40 °C max./70 % RH max.
A
B
C
Top and Bottom View Side View
D
160–220
300
250
200
150
100
50
0
10–20
Temperature (°C)
120
Preheating Soldering Cooling
Time (seconds)
Solder Refl ow Recommendations
Notes:
• MF-USMF models cannot be wave soldered.
• If refl ow temperatures exceed the recommended profi le,
devices may not meet the performance requirements.
• Compatible with Pb and Pb-free solder refl ow profi les.
• Excess solder may cause a short circuit, especially during hand
soldering. Please refer to the Multifuse
®
Polymer PTC Soldering
Recommendation guidelines.
Recommended Pad Layout
2.5 ± 0.1
(.098 ± .004)
2.0 ± 0.1
(.079 ± .004)
1.0 ± 0.05
(.039 ± .002)
1.0 ± 0.05
(.039 ± .002)