Datasheet

5
Regulatory Information
ACPL-072L has been approved while ACPL-772L is pending approval from the following organizations:
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884 Teil 2):2003-01.
(option 060 only)
UL
Approved under UL 1577, component recognition program up, File E55361.
CSA
Approved under CSA Component Acceptance Notice #5, File CA 88324.
Solder Reflow Temperature Profile
Note: Non-halide flux should be used
Recommended Pb-Free IR Profile
Note: Non-halide flux should be used
217 ˚ C
RAMP-DOWN
6
˚ C/SEC. MAX.
RAMP-UP
3
˚ C/SEC. MAX.
150 - 200 ˚ C
260 +0/-5
˚ C
t 25
˚
C to PEAK
60 to 150 SEC.
20-40 SEC.
TIME WITHIN 5
˚
C of ACTUAL
PEAK TEMPERATURE
t
p
t
s
PREHEAT
60 to 180 SEC.
t
L
T
L
T
smax
T
smin
25
T
p
TIME
TEMPERATURE
NO TES:
THE TIME FROM 25
˚ C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
smax
= 200 ˚ C, T
smin
= 150 ˚ C
0
TIME (SECONDS)
TEMPERATURE (
˚
C)
200
100
50 150100 200 250
300
0
30
SEC.
50 SEC.
30
SEC.
160 ˚C
140 ˚C
150 ˚C
PEAK
TEMP.
245 ˚C
PEAK
TEMP.
240 ˚C
PEAK
TEMP.
230˚C
SOLDERING
TIME
200˚C
PREHEATING TIME
150 ˚C, 90 + 30 SEC.
2.5˚ C ± 0.5˚C/SEC.
3˚C + 1˚C/-0.5 ˚C
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
PREHEATING RATE 3˚C + 1˚C/-0.5 ˚C/SEC.
REFLOW HEATING RATE 2.5˚C ± 0.5˚C/SEC.