Datasheet

4
Solder Reow Thermal Prole
Recommended Pb-Free IR Prole
Note: Non-halide ux should be used.
0
TIME (SECONDS)
TEMPERATURE ( °C)
200
100
50 150100 200 250
300
0
30
SEC.
50 SEC.
30
SEC.
160 °C
140 °C
150 °C
PEAK
TEMP.
245
°
C
PEAK
TEMP.
240 °C
PEAK
TEMP.
230 °C
SOLDERING
TIME
200 °C
PREHEATING TIME
150 °C, 90 + 30 SEC.
2.5 °C ± 0.5 °C/SEC.
3°C + 1 °C/ - 0.5 °C
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
PREHEATING RATE 3 °C + 1 °C/ - 0.5 ° C/SEC.
REFLOW HEATING RATE 2.5
°
C ± 0.5
°
C/SEC.
217 °C
RAMP-DOWN
6
°
C/SEC. MAX.
RAMP-UP
3
°
C/SEC. MAX.
150 - 200
°
C
260 +0/-5 °C
t 25
°
C to PEAK
60 to 150 SEC.
20-40 SEC.
TIME WITHIN 5
°
C of ACTUAL
PEAK TEMPERATURE
t
p
t
s
PREHEAT
60 to 180 SEC.
t
L
T
L
T
smax
T
smin
25
T
p
TIME
TEMPERATURE
NO TES:
THE TIME FROM 25°C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
smax
= 200 °C, T
smin
= 150 °C
Note: Non-halide ux should be used.