Datasheet

6
Absolute Maximum Rating
Parameter Symbol Min. Max. Units Note
Storage Temperature T
S
-55 125 °C
Operating Temperature T
A
-40 100 °C
Average Forward Input Current I
F(AVG)
10 mA
Peak Transient Input Current I
F(TRAN)
( ≤ 1 µs Pulse Width, 300 pps)
1.0 A
( ≤ 200 µs Pulse Width, < 1% Duty Cycle)
40 mA
Reverse Input Voltage V
R
5 V
Average Output Current I
O
25 mA
Supply Voltage V
CC
0 25 V
Output Voltage V
O
-0.5 25 V
Total Package Power Dissipation P
T
210 mW 1
Lead Solder Temperature (Through Hole Parts Only) 260 °C for 10 sec., 1.6 mm below seating plane
Solder Reow Temperature Prole (Surface Mount Parts Only) See Package Outline Drawings section
Parameter Symbol Min. Max. Units
Power Supply Voltage V
CC
4.5 20 V
Forward Input Current (ON) I
F(ON)
6 10 mA
Forward Input Voltage (OFF) V
F(OFF)
- 0.8 V
Operating Temperature T
A
-40 100 C
OUTPUT POWER - P
S
, INPUT CURRENT - I
S
0
0
T
A
- CASE TEMPERATURE -
o
C
20050
400
12525 75 100 150
600
800
200
100
300
500
700
175
P
S
(mW)
I
S
(mA)
Recommended Operating Conditions
Thermal Derating Curve