Datasheet

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APDS-9006-020

Miniature Surface-Mount Ambient Light Photo Sensor

Data Sheet

Description

The APDS-9006 is a low cost analog-output ambient light

photo sensor in a Reverse Mount, 4 pin miniature chipLED

lead free surface mount package, with temperature and

voltage compensation features. It consists of a spectrally

suited photo sensor, which provides excellent respon-

sivity that is close to the response of the human eyes, as

shown in gure 2.

The APDS-9006 is ideal for applications in which the

measurement of ambient light is used to control display

backlighting such as in Note-book, mobile phone, PDA

applications that draw heavy current from display back-

lighting will benet from incorporating these photo

sensor products in their designs by reducing power con-

sumption signicantly. Other applications include ESS,

Automatic Residential and Commercial Lighting Manage-

ment.

Features

• Excellent responsivity which peaks in the human

luminosity curve, close responsivity to the human eye

• ChipLED surface-mount package – Reverse Mounting

Height – 1.10mm

Width – 3.20mm

Depth – 1.60mm

• Good output linearity across wide illumination range

• Low sensitivity variation across various light sources

• Stable performance over temperature and voltage

• Operating temperature, -40°C to 85°C

• Vcc supply 2.4 to 5.5V

• Lead-free package

Applications

• Detection of ambient light to control display

backlighting

Mobile devices – Mobile phones, PDAs

Computing devices – Notebooks, Webpads

Consumer devices – TVs, Video Cameras, Digital Still

Cameras

• Automatic Residential and Commercial Lighting

Management

• Electronic Signs and Signals

Summary of content (12 pages)

PAGE 1
APDS-9006-020 Miniature Surface-Mount Ambient Light Photo Sensor Data Sheet Description Features The APDS-9006 is a low cost analog-output ambient light photo sensor in a Reverse Mount, 4 pin miniature chipLED lead free surface mount package, with temperature and voltage compensation features. It consists of a spectrally suited photo sensor, which provides excellent responsivity that is close to the response of the human eyes, as shown in figure 2.
PAGE 2
Application Support Information The Application Engineering Group is available to assist you with the application design associated with APDS9006 ambient light photo sensor module. You can contact them through your local sales representatives for additional details.
PAGE 3
Recommended Operating Conditions Parameter Symbol Min. Max. Units Operating Temperature TA -40 85 °C Storage Temperature TS -40 85 °C Supply Voltage VCC 2.4 5.5 V Conditions Electrical & Optical Specifications (Ta=25°C) Parameter Symbol Min. Typ. Max.
PAGE 4
1.5 1.2 1.4 1 1.3 0.8 1.1 Rel I-Out REL I-OUT 1.2 1 0.9 0.6 0.4 0.8 0.7 0.2 0.6 0.5 0 1 2 3 VCC 4 5 6 Figure 5. Relative Output Current Vs Vcc (Ta = 25°C, 100Lux) Figure 6. Relative Iout Vs Angle (Vcc = 3V, Ta = 25°C) 12 16.0E-3 T-r 10 Settling Time [mSec] 14.0E-3 12.0E-3 Time [Secs] 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 Angle in Degrees T-f 10.0E-3 8.0E-3 6.0E-3 4.0E-3 2.0E-3 000.
PAGE 5
APDS-9006 Light Measurement Circuit and Waveforms I_pulse VOUT 90% 10% GND tf tr td ts
PAGE 6
APDS-9006 Package Outline
PAGE 7
APDS-9006 Tape and Reel Dimensions
PAGE 8
Moisture Proof Packaging Chart All APDS-9006 options are shipped in moisture proof package. Once opened, moisture absorption begins. This part is compliant to JEDEC Level 3. Baking conditions Recommended Storage Conditions If the parts are not stored in dry conditions, they must be baked before reflow to prevent damage to the parts. Package Temp. Time In Reels 60°C 48 hours In Bulk 100°C 4 hours Baking should only be done once.
PAGE 9
Recommended Reflow Profile MAX 260C T - TEMPERATURE (˚C) 255 R3 230 217 200 180 R2 R4 60 sec to 90 sec Above 217 C 150 R5 R1 120 80 25 0 P1 HEAT UP 50 100 P2 SOLDER PASTE DRY 150 250 P4 COOL DOWN 300 t-TIME (SECONDS) Process Zone Symbol DT Maximum DT/Dtime or Duration Heat Up P1, R1 25°C to 150°C 3°C/s Solder Paste Dry P2, R2 150°C to 200°C 100s to 180s Solder Reflow P3, R3 200°C to 255°C 3°C/s P3, R4 255°C to 200°C -6°C/s P4, R5 200°C to 25°C -6°C/s Time maintained a
PAGE 10
1.2 Recommended Metal Solder Stencil Aperture Appendix A: SMT Assembly Application Note 1.0 Solder Pad, Mask and Metal Metal Stencil For Solder Paste Printing Stencil Aperture It is recommended that a 0.11 mm (0.004 inches) thick stencil be used for solder paste printing. Aperture opening for shield pad is 0.6mm x 0.71mm. This is to ensure adequate printed solder paste volume and no shorting. Aperture Opening 0.11 Land Pattern Solder Mask 1.7 PCBA Aperture Opening 3.31 Unit: mm Figure A3.
PAGE 11
Appendix B: Optical Window Design for APDS-9006 2.0 Optical Window Dimensions To ensure that the performance of the APDS-9006 will not be affected by improper window design, there are some constraints on the dimensions and design of the window. There is a constraint on the minimum size of the window, which is placed in front of the photo light sensor, so that it will not affect the angular response of the APDS-9006. This minimum dimension that is recommended will ensure at least a ±35° light reception cone.
PAGE 12
The recommended minimum window dimension is based on the assumption that the center of the window and the center of the light receiving of the photo sensor are the same. It is recommended that the tolerance for assembly be considered as well.