Datasheet

10
Appendix A: SMT Assembly Application Note
1.0 Solder Pad, Mask and Metal Stencil Aperture
Figure A1. Stencil and PCBA
1.1 Recommended Land Pattern
Figure A2. Recommended Land Pattern
1.2 Recommended Metal Solder Stencil Aperture
It is recommended that a 0.11 mm (0.004 inches) thick
stencil be used for solder paste printing. Aperture
opening for shield pad is 0.9mm x 0.8mm (as per land
pattern). This is to ensure adequate printed solder paste
volume and no shorting.
Figure A3. Solder Stencil Aperture
1.3 Adjacent Land Keepout and Solder Mask Areas
Adjacent land keep-out is the maximum space occupied
by the unit relative to the land pattern. There should be
no other SMD components within this area.
The minimum solder resist strip width required to avoid
solder bridging adjacent pads is 0.2 mm.
Note: Wet/Liquid Photo-Imageable solder resist/mask is recommended.
Figure A4. Adjacent Land Keepout and Solder Mask Areas
PCBA
Solder
Mask
Land
Pattern
Stencil
Aperture
Metal Stencil For
Solder Paste
Printing
Unit:
mm
Mounting
Center
0.8
0.8
0.9 0.9 0.7
0.3
1.4
3.2
2.20.6
3.2
2.2
0.1
1
Unit: mm
Aperture
Opening
4.2
3.2
Unit:
mm
0.2
MIN.
Mounting
Center