Datasheet

ManualsBrandsBROADCOM ManualsHighPower-LEDsHighPower LED Red 1 W 40 lm 120 ° 2.4 V 350 mA

Description

The Moonstone

1W Power LED Light Source is a high

performance energy ecient device which can handle

high thermal and high driving current. The exposed pad

design has excellent heat transfer from the package to

the motherboard.

The Cool White Power LED is available in various color

temperature ranging from 4000K to 10000K and Warm

White Power LED ranging from 2600K to 4000K.

The low prole package design is suitable for a wide

variety of applications especially where height is a

constraint.

The package is compatible with reow soldering

process. This will give more freedom and exibility to

the light source designer.

Applications

• Portable (ash light, bicycle head light)

• Reading light

• Architectural lighting

• Garden lighting

• Decorative lighting

ASMT-Mx00

Moonstone

1 W Power LED Light Source

Data Sheet

Features

• Available in Red, Amber, Green, Blue, Cool White and

Warm White color

• Energy ecient

• Exposed pad for excellent heat transfer

• Suitable for reow soldering process

• High current operation

• Long operation life

• Wide viewing angle

• Silicone encapsulation

• ESD Class HBM Class 3B (threshold > 8 kV)

• MSL 2A for InGaN products

• MSL 4 for AlInGaP products

Specications

• AlInGaP technology for Red and Amber

• 2.4 V (typ) at 350 mA for AlInGaP

• InGaN technology for Green, Blue, Cool White and

Warm White

• 3.6 V (typ) at 350 mA for InGaN

• 120 viewing angle

Summary of content (13 pages)

PAGE 1
ASMT-Mx00 MoonstoneTM 1 W Power LED Light Source Data Sheet Description Features The Moonstone 1W Power LED Light Source is a high performance energy efficient device which can handle high thermal and high driving current. The exposed pad design has excellent heat transfer from the package to the motherboard. TM The Cool White Power LED is available in various color temperature ranging from 4000K to 10000K and Warm White Power LED ranging from 2600K to 4000K.
PAGE 2
Package Dimensions 10.00 1 Anode 2 Cathode 3 Heat Sink 3.30 8.50 1.27 Metal Slug 3 Ø 5.26 10.60 8.50 LED + − ZENER Ø 8.00 2.00 5.25 1.30 2 1 5.08 0.81 Device Selection Guide at Junction Temperature Tj = 25°C Luminous Flux, fV[1,2] (lm) Color Part Number Min. Typ. Max. Test Current (mA) Dice Technology Red ASMT-MR00-AGH00 25.5 35.0 43.0 350 AlInGaP Red ASMT-MR00-AHJ00 33.0 40.0 56.0 350 AlInGaP Amber ASMT-MA00-AGH00 25.5 35.0 43.
PAGE 3
Part Numbering System ASMT-M x 00 – N x 1 x 2 x 3 0 Packaging Option 0 – Tube 1 – Tape & Reel Color Bin Selection Max Flux Bin Selection Min Flux Bin Selection Color R – Red A – Amber B - Blue G - Green W - Cool White Y - Warm White Absolute Maximum Ratings (TA = 25°C) Parameter DC Forward Current ASMT-Mx00 Units 350 mA Peak Pulsing Current [2] 500 mA Power Dissipation for AlInGaP 1050 mW Power Dissipation for InGaN 1400 mW LED Junction Temperature for AlInGaP 125 °C LED Junction Temperat
PAGE 4
Optical Characteristics (TA = 25 °C) Part Number Color Peak Wavelength lPEAK (nm) Typ. Dominant Wavelength lD [1] (nm) Typ. Viewing Angle 2q1/2 [2] (Degrees) Typ. Luminous Efficiency (lm/W) Typ.
PAGE 5
RED AMBER FORWARD CURRENT - mA RELATIVE INTENSITY 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 380 430 480 530 580 630 WAVELENGTH - nm 680 730 780 Figure 1. Relative Intensity vs. Wavelength for AlInGaP 500 450 400 350 300 250 200 150 100 50 0 0.00 1.0 RELATIVE INTENSITY RELATIVE LUMINOUS FLUX (-v) - lm 1.2 0.8 0.6 0.4 0.2 0 50 100 150 200 250 300 350 400 MONO PULSE CURRENT - mA 450 500 Figure 3. Relative Luminous Flux vs.
PAGE 6
GREEN BLUE COOL WHITE WARM WHITE 430 480 530 580 630 WAVELENGTH - nm 680 730 FORWARD CURRENT - mA RELATIVE INTENSITY 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 380 780 1.2 1.0 RELATIVE INTENSITY RELATIVE LUMINOUS FLUX (φV) - lm 1.4 0.8 0.6 0.4 0.2 0 50 100 150 200 250 300 350 400 450 500 MONO PULSE CURRENT - mA 540 350 530 RθJA = 50 C/W RθJA = 40 C/W 200 RθJA = 30 C/W 150 100 50 0 0 10 20 30 40 50 60 70 T A – AMBIENT TEMPERATURE – °C 80 90 Figure 11.
PAGE 7
0.016 100 mA 0.014 150 mA 0.012 0.01 0.008 TEMPERATURE Y-COORDINATES 10 - 30 SEC. 250 mA 0.006 0.004 217 °C 200 °C 3 °C/SEC. MAX. 300 mA 60 - 120 SEC. 350 mA 0.001 0.002 0.003 0.004 0.005 0.006 0.007 0.008 X-COORDINATES Figure 13. Chromaticity shift vs. current *Note: (x,y) values @ 350 mA reference to (0.0) 8.40 ± 0.10 17.00 ± 0.20 1.00 ± 0.10 3.1 ± 0.10 5.08 ± 0.10 Figure 15.
PAGE 8
Flux Bin Limit (for reference only) [x1 x2] Color Bin Limits Luminous Flux (lm) at IF = 350mA Amber Min. (nm) Max. (nm) Bin Min Max A 582.0 584.5 D 11.5 15.0 B 584.5 587.0 E 15.0 19.5 C 587.0 589.5 F 19.5 25.5 D 589.5 592.0 G 25.5 33.0 E 592.0 594.5 Tolerance: ±1nm H 33.0 43.0 J 43.0 56.0 Blue Min. (nm) Max. (nm) K 56.0 73.0 A 460.0 465.0 B 465.0 470.0 C 470.0 475.0 D 475.0 480.0 Green Min. (nm) Max. (nm) A 515.0 520.0 B 520.0 525.
PAGE 9
Color Bin Limit Cool White Color Limits (Chromaticity Coordinates) Bin A x y 0.367 0.400 0.362 0.372 0.329 0.345 0.329 0.369 Bin B x y 0.362 0.372 0.356 0.330 0.329 0.302 Bin C x y 0.329 0.369 0.329 0.345 Bin D x y 0.329 0.345 Bin E x y Bin F Warm White Color Limits (Chromaticity Coordinates) Bin A 0.329 0.345 x y 0.452 0.434 0.488 0.447 0.470 0.414 0.438 0.403 Bin B 0.305 0.322 0.301 0.342 x y 0.438 0.403 0.470 0.414 0.452 0.384 0.424 0.376 Bin C 0.329 0.302 0.
PAGE 10
Sub-Color Binning (Only Applicable for Color Bin A to Bin D and Bin G to Bin H) Color Limits Cool White (Chromaticity Coordinates) Bin A1 X Y X Y X Y X Y X Y X Y X Y X Y X Y X Y X Y X Y X Y X Y Bin A2 Bin A3 Bin A4 Bin B1 Bin B2 Bin B3 Bin B4 Bin B5 Bin B6 Bin C1 Bin C2 Bin C3 Bin C4 0.364 0.383 0.364 0.383 0.329 0.357 0.329 0.345 0.362 0.372 0.360 0.357 0.358 0.343 0.329 0.331 0.329 0.331 0.343 0.331 0.329 0.369 0.329 0.357 0.314 0.355 0.315 0.344 0.367 0.400 0.362 0.372 0.329 0.369 0.329 0.357 0.
PAGE 11
Packing Tube - Option 0 1.00 5.80 4.65 5.50 37.00 5.45 10.10 8.30 535.00 SIDE VIEW TOP VIEW Tape & Reel - Option 1 Tape Dimension Dim Value A0 8.80±0.10 B0 16.45±0.10 K0 3.60±0.10 W 24.0±0.10 P 16.0±0.
PAGE 12
Tape & Reel - Option 1 (Cont.) Tape Dimension END START THERE SHALL BE A MINIMUM OF 160 mm OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 390 mm OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. Reel Dimensions +1.00 24.0 −0.00 2.30 2.30 0 2.50 ± 0.50 0º 60. ∅99.50 ± 1.00 R10.0 ± .50 ∅268.00 0 0.5 R10 ∅13.50 ∅330.00 ± 1.00 120.0º ± 0.
PAGE 13
Handling Precaution The encapsulation material of the product is made of silicone for better reliability of the product. As silicone is a soft material, please do not press on the silicone or poke a sharp object onto the silicone. These might damage the product and cause premature failure. During assembly or handling, the unit should be held on the body only. Please refer to Avago Application Note AN5288 for detail information.