Datasheet

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ASMT-MT00

Moonstone® Tri-Color Power LED Light Source

Data Sheet

Description

The Moonstone® Tri-Color Power LED Light Source is a high

performance energy ecient device which can handle

high thermal and high driving current. The exposed pad

design enables excellent heat transfer from the package

to the motherboard.

The low prole package design is suitable for a wide variety

of applications especially where height is a constraint.

The package is compatible with reow soldering process.

This will give more freedom and exibility to the light

source designer.

Applications

• Contour lighting

• Cove lighting

• Architectural lighting

• Garden lighting

• Decorative lighting

• Commercial lighting

• Mood lighting

Features

• Available in Tri-color.

• Energy ecient.

• Exposed pad for excellent heat transfer.

• Suitable for reow soldering process.

• High current operation.

• Long operation life.

• Wide viewing angle.

• Silicone encapsulation.

• Non-ESD sensitive (threshold > 16KV).

• MSL 5a products.

Specications

• 3.5 V (max) at 350 mA for InGaN

• 2.3 V (max) at 350 mA for AlInGaP

• 120° viewing angle

Summary of content (9 pages)

PAGE 1
ASMT-MT00 Moonstone® Tri-Color Power LED Light Source Data Sheet Description Features The Moonstone® Tri-Color Power LED Light Source is a high performance energy efficient device which can handle high thermal and high driving current. The exposed pad design enables excellent heat transfer from the package to the motherboard. • Available in Tri-color. The low profile package design is suitable for a wide variety of applications especially where height is a constraint. • High current operation.
PAGE 2
Package Dimensions 3.30 R+ 10.00 Metal Slug ( Heat Sink) 1.27 ∅ 8.00 10.50 8.50 5.25 G+ G- R- R+ B- B+ 1.27 0.64 Notes: 1. All dimensions in millimeters. 2. Tolerance is ±0.1 mm unless otherwise specified. 3. Metal slug is connected to the anode of Red. Device Selection Guide (Tj = 25°C) Luminous Flux, ΦV [1,2] (lm) Part Number Color Min. Typ. Max. Test Current (mA) Dice Technology ASMT-MT00 Red 33.0 40.0 56.0 350 AlInGaP Green 73.0 85.0 124.0 InGaN Blue 9.0 13.0 19.
PAGE 3
Part Numbering System ASMT-MT00 – 0 x1 x2 x3 x4 Packaging Option Color Bin Selection Number of Flux Bins Starting from Selected x2 Minimum Flux Bin Note: 1. Please refer to Page 6 for selection details.
PAGE 4
1.2 GREEN BLUE RED 1 RELATIVE LUMINOUS FLUX (NORMALIZED AT 350 mA) RELATIVE INTENSITY 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0.8 0.6 0.4 0.2 380 430 480 530 580 630 WAVELENGTH - nm 680 730 0 780 Figure 1. Relative Intensity vs. Wavelength. NORMALIZED INTENSITY FORWARD CURRENT - mA 300 250 AlInGaP InGaN 200 150 100 50 0 1 2 FORWARD VOLTAGE - V 3 4 RED BLUE GREEN 25 50 75 100 125 JUNCTION TEMPERATURE,TJ - °C Figure 5. Forward Voltage Shift vs. Junction Temperature.
PAGE 5
400 350 350 MAX ALLOWABLE DC CURRENT - mA MAX ALLOWABLE DC CURRENT - mA 400 300 250 200 RθJ-A = 30°C/W RθJ-A = 40°C/W RθJ-A = 50°C/W 150 100 50 0 0 20 40 60 80 100 AMBIENT TEMPERATURE, TA - °C 120 140 Figure 7. Maximum Forward Current vs. Ambient Temperature for InGaN. Derated based on TJMAX = 125°C, RθJ-A = 30°C/W, 40°C/W and 50°C/W. 300 250 200 RθJ-A = 30°C/W RθJ-A = 40°C/W RθJ-A = 50°C/W 150 100 50 0 0 20 40 60 80 100 AMBIENT TEMPERATURE, TA - °C 120 140 Figure 8.
PAGE 6
Option Selection Details ASMT-MT00 – 0 x1 x2 x3 x4 x1 – Minimum Flux Bin x2 – Number of Flux Bins Starting from Selected x1 x3 – Color Bin Selection x4 – Packaging Option Flux Bin Selection [x1, x2] Flux Bin Limit Individual reel will contain part from 1 bin only. Minimum Flux Bin x1 Red Green 0 Full Distribution A H J Blue C Number of Flux Bins Starting from Selected x1 x2 Red Green Blue 0 Full Distribution A 2 2 2 B 2 2 3 D 2 3 3 Luminous Flux (lm) at IF = 350 mA Bin ID Min.
PAGE 7
CIE 1931 Chromaticity Diagram 0.90 0.80 A B C D 0.70 Green Y-COORDINATE 0.60 0.50 0.40 0.30 Red 0.20 D Blue C 0.10 B A 0.00 0.00 0.10 0.20 0.30 0.40 0.50 X-COORDINATE 0.60 0.70 0.80 Figure 12. CIE 1931 Chromaticity Diagram. Tape and Reel – Option 1 B Bo W F E A 2.5 B A Ko P SECTION A Ao SECTION B Figure 13. Carrier tape dimensions. 7 Dim Value A0 8.80 ±0.10 B0 16.45 ±0.10 K0 3.60 ±0.1 E 1.75 ±0.10 F 11.50 ±0.10 W 24.0 ±0.10 P 16.0 ±0.
PAGE 8
END START MINIMUM OF 160 mm OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MOUNTED WITH COMPONENTS MINIMUM OF 390 mm OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. Figure 14. Carrier tape leader and trailer dimensions. *Note: Tape & Reel Packaging only applicable as per this datasheet only. +1.00 24.0 −0.00 2.30 2.30 0 2.50 ± 0.50 0º 60. ∅99.50 ± 1.00 R10.0 50 10. ∅268.00 R ∅13.50 ∅330.00 ± 1.00 120.0º Figure 15. Reel dimensions. 8 .50 ±0 ± 0.
PAGE 9
Handling Precaution The encapsulation material of the product is made of silicone for better reliability of the product. As silicone is a soft material, please do not press on the silicone or poke a sharp object onto the silicone. These might damage the product and cause premature failure. During assembly or handling, the unit should be held on the body only. Please refer to Avago Application Note AN5288 for detail information.