Datasheet

3
Part Numbering System
Color Bin Selection
Number of Flux Bins Starting from Selected x
2
Minimum Flux Bin
ASMT-MT00 – 0 x
1
x
2
x
3
x
4
Packaging Option
Note:
1. Please refer to Page 6 for selection details.
Absolute Maximum Ratings
Parameter AllnGaP InGaN Units
DC Forward Current
[1]
350 350 mA
Peak Pulsing Current
[2]
1000 1000 mA
Power Dissipation 805 1225 mW
LED Junction Temperature 125 125 °C
Operating Metal Slug Temperature Range at 350 mA -40 to +105 -40 to +105 °C
Storage Temperature Range -40 to +120 -40 to +120 °C
Soldering Temperature Refer to Figure. 10
Note:
1. Derate linearly based on Figure. 7 for InGaN and Figure. 8 for AlInGaP.
2. Pulse condition duty factor = 10 %, Frequency = 1 kHz.
Optical Characteristics at 350 mA (T
J
= 25°C)
Part Number Color
Peak Wavelength,
λ
PEAK
(nm)
Dominant Wavelength,
λ
D
[1]
(nm)
Viewing Angle,
2θ
½
[2]
(°)
Luminous Eciency
(lm/W)
Typ. Typ. Typ. Typ.
ASMT-MT00 Red 635 625 120 54
Green 519 525 120 76
Blue 454 460 120 12
Notes:
1. The dominant wavelength, λ
D
, is derived from the CIE Chromaticity Diagram and represents the color of the device.
2. θ½ is the o-axis angle where the luminous intensity is ½ the peak intensity.
Electrical Characteristic at 350 mA (T
J
= 25°C)
Dice Type
Forward Voltage,
V
F
(Volts) at I
F
= 350mA
Reverse Voltage,
V
R
[1]
Thermal Resistance,
Rθ
j-ms
(°C/W)
[2]
Min. Typ. Max. Typ.
AllnGaP 1.7 2.1 2.3 Not recommended 23
InGaN 2.8 3.2 3.5 20
Notes:
1. Not designed for reverse bias operation.
2. Rθ
j-ms
is Thermal Resistance from LED junction to metal slug. All 3 colors are lighted up at once during measurement.