Datasheet

10
Absolute Maximum Ratings
Parameter Symbol Min. Max. Units Note
Storage Temperature T
S
-55 125 °C
Operating Temperature T
A
-40 85 °C
Average Forward Input Current I
F(AVG)
10 mA 1
Peak Transient Input Current
(≤ 1 µs Pulse Width, 300 pps) I
F(TRAN)
1.0 A 1
(≤ 200 µs Pulse Width, HCNW22XX 40 mA
< 1% Duty Cycle)
Reverse Input Voltage V
R
5 V 1
HCNW22XX 3
Average Output Current I
O
25 mA 1
Supply Voltage V
CC
0 20 V
Output Voltage V
O
-0.5 20 V 1
Total Package Power Dissipation P
T
210 mW 2
HCPL-223X 294
Output Power Dissipation P
O
See Figure 7 1
Lead Solder Temperature (Through Hole Parts Only) 260°C for 10 sec.,
1.6 mm below seating plane
HCNW22XX 260°C for 10 sec., up to seating plane
Solder Reow Temperature Prole See Package Outline Drawings section
(Surface Mount Parts Only)
Recommended Operating Conditions
Parameter Symbol Min. Max. Units
Power Supply Voltage V
CC
4.5 20 V
Forward Input Current (ON) I
F(ON)
1.6* 5 mA
HCPL-223X 1.8†
Forward Input Voltage (OFF) V
F(OFF)
- 0.8 V
Operating Temperature T
A
-40 85 °C
Junction Temperature T
J
-40 125 °C
Fan Out N 4 TTL Loads
*The initial switching threshold is 1.6 mA or less. It is recommended that 2.2 mA be used to permit at least a 20% LED degradation guardband.
†The initial switching threshold is 1.8 mA or less. It is recommended that 2.5 mA be used to permit at least a 20% LED degradation guardband.