Datasheet

9
Absolute Maximum Ratings
Parameter Symbol Device Min. Max. Units Note
Storage Temperature* T
S
-55 125 °C
Operating Temperature* T
A
8-Pin DIP -55 100 °C
SO-8
Widebody -55 85
Average Forward Input Current* I
F(AVG)
25 mA 1
Peak Forward Input Current* I
F(PEAK)
8-Pin DIP 2
(50% duty cycle, 1 ms pulse width) SO-8 50 mA
(50% duty cycle, 1 ms pulse width) Widebody 40
Peak Transient Input Current* I
F(TRANS)
8-Pin DIP 1 A
(≤1 µs pulse width, 300 pps) SO-8
Widebody 0.1
Reverse LED Input Voltage* (Pin 3-2) V
R
8-Pin DIP 5 V
SO-8
Widebody 3
Input Power Dissipation* P
IN
8-Pin DIP 45 mW 3
SO-8
Widebody 40
Average Output Current* (Pin 6) I
O(AVG)
8 mA
Peak Output Current* I
O(PEAK)
16 mA
Emitter-Base Reverse Voltage* V
EBR
5 V
(Pin 5-7, except 4502/3, 0452/3)
Supply Voltage (Pin 8-5) V
CC
-0.5 30 V
Output Voltage (Pin 6-5) V
O
-0.5 20 V
Supply Voltage* (Pin 8-5) V
CC
-0.5 15 V
Output Voltage* (Pin 6-5) V
O
-0.5 15 V
Base Current* (Pin 7, except 4502/3, 0452/3) I
B
5 mA
Output Power Dissipation* P
O
100 mW 4
Lead Solder Temperature*
(Through-Hole Parts Only)
1.6 mm below seating plane, 10 seconds T
LS
8-Pin DIP 260 °C
up to seating plane, 10 seconds Widebody 260 °C
Reow Temperature Prole T
RP
SO-8 and
Option 300
*Data has been registered with JEDEC for the 6N135/6N136.
See Package Outline Drawings
section